Taiwan Semiconductor Manufacturing Comp. Ltd.

Other

Marketech International Corporation

Ping-Hsu Chen

Henry Lo

Francis Ko

Chien-Kuo Lu

Jean Wang

Chih-Wei Lai

Chao-Jung Chang

Hsao-Szu Chang

Syun-Ming Jang Jang

Chi-Hung Liao

Yung-Yao Lee

Chun-Hsien Lin

Yu-Liang Lin

Ai-Sen Liu

Wei Chang Cheng

Ping Chuang

Yu-Huei Chen

Chi-Yuan Pung

Shang-Ting Tsai

Chi-Ta Yeh

T S Lo

Chen-Hua Douglas Yu

Sunny Wu

Kewei Zuo

Jui-Cheng Lo

Chin-Hsin Peng

Chien-Ling Huang

Chun-Hsien Lim

An active fluid static elimination system installed in a fluid transportation pipeline includes a solenoid valve, an electrostatic measuring device, a fluid destaticizer, and a controller. The solenoid valve is connected to a connecting port of the fluid transportation pipeline, and the electrostatic measuring device is used to measure an electrostatic value of a fluid in the fluid transportation pipeline. The fluid destaticizer is connected to the solenoid valve, and the controller is connected to the electrostatic measuring device and the solenoid valve. The solenoid valve is opened to allow the fluid passing through the fluid destaticizer to eliminate the electrostatic charge of the fluid when the controller determines that the electrostatic value measured by the electrostatic measuring device is greater than a predetermined value.

Active fluid static elimination system

A multifunction cap replacement module includes a cap rotation module supporter and at least one cap rotation module. The cap rotation module is mounted to the cap rotation module supporter, and the cap rotation module includes a first cap rotation device and a second cap rotation device. The first cap rotation device is configured to open one sealing cap of at least one chemical drum and extract a chemical liquid from the chemical drum, and the second cap rotation device is configured to open another one sealing cap of the chemical drum and allow the chemical liquid to flow back to the chemical drum.

Multifunction cap replacement module

A cap rotation device includes a cap rotator, a liquid transferring device and an optical detecting device. The liquid transferring device is disposed near the cap rotator, and the optical detecting device is disposed between the cap rotator and the liquid transferring device. The optical detecting device is used to detect a position of a sealing cap of a chemical drum to guide the cap rotator aligning with the sealing cap. Therefore, the sealing cap is opened by the cap rotator, and then the chemical liquid is transferred by the liquid transferring device.

Cap rotation device

A vortex generator including an annular bearing for mounting on an interior surface of an exhaust line. The vortex generator further includes an annular blade assembly mounted on the annular bearing. The annular blade assembly includes a leading face with an upstream opening having a first radius. The annular blade assembly further includes a trailing face with a downstream opening having a second radius, wherein the upstream opening and the downstream opening are centered around a longitudinal axis of the exhaust line, and the second radius is different from the first radius. The annular blade assembly further includes a side extending from the leading face to the trailing face, wherein the side has a plurality of openings, each opening of the plurality of openings containing a blade, and each opening of the plurality of openings extends beyond the annular bearing in a direction parallel to the longitudinal axis.

Exhaust system and method of using

A vortex generator for an exhaust system includes an annular bearing for mounting on an interior surface of an exhaust line. The vortex generator further includes a flow splitter mounted on the annular bearing. The flow splitter includes a leading face with an upstream opening. The flow splitter further includes a trailing face with a downstream opening, wherein the upstream opening and the downstream opening are centered around a longitudinal axis of the exhaust line. The flow splitter further includes a side extending from the leading face to the trailing face, wherein the side has a plurality of openings, each opening of the plurality of openings containing a blade, and wherein a trailing side of each blade faces the longitudinal axis.

A method to enable wafer result prediction includes collecting manufacturing data from various semiconductor manufacturing tools and metrology tools; choosing key parameters using an autokey method based on the manufacturing data; building a virtual metrology based on the key parameters; and predicting wafer results using the virtual metrology.

Automatic virtual metrology for semiconductor wafer result prediction

A system and method for controlling resistivity uniformity in a Copper trench structure by controlling the CMP process is provided. A preferred embodiment comprises a system and a method in which a plurality of CMP process recipes may be created comprising at least a slurry arm position. A set of metrological data for at least one layer of the semiconductor substrate may be estimated, and an optimum CMP process recipe may be selected based on the set of metrological data. The optimum CMP process recipe may be implemented on the semiconductor substrate.

Method and system for controlling copper chemical mechanical polish uniformity

A method of monitoring uniformity of a wafer is provided. A wafer parameter is selected. Manufacturing data is collected. The manufacturing data includes measurements of the selected wafer parameter. An average offset profile of the wafer parameter for a first and second wafer is determined using the manufacturing data. The first and second wafer are associated with a product type and were processed by a processing tool. An offset profile for a third wafer is predicted for a wafer using the average offset profile. The third wafer is associated with the product type and was processed by the processing tool.

Prediction of uniformity of a wafer

A method for monitoring a processing tool in a semiconductor manufacturing facility includes selecting key hardware parameters for a virtual sensor system based on manufacturing data associated with a fabrication tool and collecting manufacturing data associated with the fabrication tool. The method further includes dynamically maintaining the virtual sensor system during the manufacture of a plurality of semiconductor products and using the virtual sensor system and the collected manufacturing data for predicting a condition of a semiconductor product after being processed by the fabrication tool.

Method and apparatus to enable accurate wafer prediction

A DMHC (dual mode hybrid control) system and method which facilitates enhanced control in the delivery of polishing slurry to a CMP (chemical mechanical polishing) apparatus. The DMHC comprises a linear table and a PID (proportional integrated differential) controller operably connected to a slurry pump provided in a slurry flow conduit which delivers the polishing slurry to the CMP apparatus. A bubble trap and a flowmeter provided in the slurry flow conduit downstream of the slurry pump are operably connected to the PID controller, and the CMP apparatus is located downstream of the flowmeter.

Dual mode hybrid control and method for CMP slurry

A method and system for monitoring the quality of a slurry utilized in a chemical mechanical polishing operation. A slurry is generally delivered through a tubular path during a chemical mechanical polishing operation. A laser light is generally transmitted from a laser light source, such that the laser light comes into contact with the slurry during the chemical mechanical polishing operation. The laser light can then be detected, after the laser light comes into contact with the slurry to thereby monitor the quality of the slurry utilized during the chemical mechanical polishing operation. The laser light that comes into contact with the slurry can be also be utilized to monitor a mixing ratio associated with the slurry.

Growing community of inventors

Hsinchu, Taiwan

Ping-Hsu Chen