United Microelectronics Corp.

Other

Industrial Technology Research Institute

National Science Council

Ping-Chung Chung

Tsung-Lin Lu

Weng-Yi Chen

Jing-Yi Huang

Sheng-Lung Huang

Tsan-Chi Chu

Shou-Nan Li

Tsang-Jung Lin

Sheng-Jen Yu

Hunter Chung

Hsiao-yu Chou

Bing-Tang Zhong

Shaw-Yi Yan

Wen-Kai Kuo

Wei-Hsu Wang

Chin-Hsien Chen

Jack Yao

Chienfeng Chen

Chang-Fu Hsu

Frank Chung

Yueh-Lin Chung

Yung-Chun Wen

Yun-Sueng Liou

Tso-Lung Lai

Wen-Fa Chen

Liang-Chih Chang

Wei-Hao Lee

Cheng-Yuan Yao

In a casting apparatus for external skeletal and joint fixation, a plurality of articulated segments may comprise a plurality of cuboid members threaded on a continuous cord having distal ends connected to actuators. The cuboid members may be disposed between guide members threaded on the cord. Actuation of the actuators applies a tension force to the cord, thereby compressing the cuboid members together to form rigid cuboid segments and maintain the casting apparatus in a rigid configuration for skeletal and joint fixation.

Casting apparatus

A method for removing high concentration ozone from a waste gas stream is disclosed, which includes the following steps: (1) providing an apparatus, which includes: a tank having an input port, an exhaust port and a packing, wherein the input port is near the bottom of the tank, the exhaust port is on the top of the tank, and the packing is contained in the tank; a liquid injection element for injecting reductant solution through the packing; and a storage vessel connecting to the liquid injection element; (2) transporting a gas into the tank through the input port for contacting the reductant solution; and (3) the gas exiting the reactor by way of the exhaust port.

Method and apparatus for removing high concentration ozone from a waste gas steam

The present invention provides a method of cleaning a chamber of a CVD machine and elements within. A gas mixture of carbon tetrafluoride (CF ) and perfluoro ethane (C F ) is first injected into the chamber. After performing a surface treatment, comprising a sandblasting step or a polishing step, on the surfaces of the elements, the elements are then immersed in a cleaning solution, comprising at least ammonia water (NH OH) and hydrogen peroxide (H O ) at a temperature maintained between 40&deg; C. to 70&deg; C. Finally, the temperature of the cleaning solution is raised so that the residual layer on the surface of the elements can drop from the surfaces of the heater and the process kits or dissolve into the cleaning solution.

Method of cleaning a chamber of a CVD machine and elements within

A method for removing extraneous matters from a stainless device is provided. The method includes the steps of (a) providing a container for holding a fluorine-containing neutral solution therein, (b) immersing said stainless device in said fluorine-containing neutral solution to remove said extraneous matters from said stainless device, and (c) heating and swirling said fluorine-containing solution. The fluorine-containing neutral solution is made from neutralizing hydrofluoric acid (HF) with ammonium hydroxide (NH,OH), neutralizing hydrofluoric acid (HF) with ammonium fluoride (NH,F), or dissolving ammonium acid fluoride (NH,F) in a deionized water (DIW).

Method for removing extraneous matter by using fluorine-containing solution

A semiconductor wafer cassette mapper. A photo-detecting array is used as a receiver. During a mapping process, an accurate and complex driving system is not necessary. The invention provides a semiconductor wafer cassette mapper. A strip light source is used as an emitter and a photo-detecting array is used as a receiver for a semiconductor wafer cassette mapper. During the mapping process, the strip light source, the photo-detecting array and the wafer cassette do not need to move for scanning. The receiver obtains an information about all wafers in the wafer cassette by receiving all signals at one time, so that a mapping time is reduced. The invention provides another semiconductor wafer cassette mapper. A parallel scanning light source serves as an emitter and a photo-detecting array serves as a receiver of semiconductor wafer cassette mapper. During the mapping process, the parallel scanning light source moves quickly to scan the wafers in the wafer cassette. The method can reduce the mapping time.

Wafer mapping apparatus

An exhaust gas treatment apparatus for treating exhaust gases generated in semiconductor manufacturing processes. It includes a main pipe, a U pipe, a discharge pipe and a tank. The main pipe has an inlet to receive exhaust gases, a heater surrounding the main pipe to heat the exhaust gases to form exhaust gas powder, a sprinkler to spray cooling water to cool the heated exhaust gases to form vapor and waste water and an outlet to discharge vapor and waste water into the U pipe. The U pipe has a first connector connecting with the main pipe and a second connector connecting with the discharging pipe. The tank is located below the U pipe under the first connector for receiving lump type exhaust gas powder scrapping from the inside wall of the main pipe. The U pipe will not be blocked by the lump type exhaust gas powder so that exhaust gas treatment efficiency won't be harmfully affected.

Exhaust gas treatment apparatus

A method for improving the uniformity of wafer-to-wafer film thicknesses. Before depositing films, shower heads in a PECVD system is heated to production temperature to make the entire system (including the shower heads) reach a stable temperature in coordination with heating of a heater block. Subsequently, a gas source, output via the shower heads, is provided, and then a plasma of the gas source is generated to form a film on the wafer due to the temperatures of the shower heads remain constant during wafers deposition. Therefore, the problem of the uneven thicknesses of films among wafers is resolved. Moreover, if the heating of the shower heads by use of a plasma (which can also be used to heat the heater block) and the heater block is concurrently performed after the preventive maintenance (PM) or open chamber cleaning of the PECVD system, the heating time of the heater block can be further shortened.

Method for improving the uniformity of wafer-to-wafer film thickness

A method is proposed for use in a chamber used in IC fabrication to adjust for parallel alignment between a shower head and a heater platform in the chamber, so that later the deposition process performed in the chamber can result in an evenly deposited layer on the wafer. This method is characterized by the provision of a plurality of displacement gauges between the shower head and the heater platform, with the heater platform being adjusted in such a manner as to allow all the distance readings from the displacement gauges to be substantially equal to a predetermined fixed value. This not only allows the shower head and the heater platform to be aligned and parallel to each other, but also allows them to be separated by a predetermined, fixed distance. The parallel alignment allows all deposition processes subsequently performed in the chamber to provide an evenly deposited layer on the wafer, and the fixed distance between the shower head and the heater platform allows the wafers fabricated from different chambers to be consistent in quality.

Method of adjusting for parallel alignment between a shower head and a heater platform in a chamber used in integrated circuit fabrication

Two-dimensional electric-filed vector is measured in this invention, wherein two linearly polarized laser beams are focused on two different bottom planes of an electro-optic crystal so that two reflected beams from the bottom planes have two different paths inside the electro-optic crystal and thus have different phase retardation when an electric-field is exerted on the electro-optic crystal by a circuit under test. The electric-filed direction of the circuit can be calculated by using two differential signals which are proportional to the phase retardation of the two reflected beams.

Electro-optic apparatus and method for measuring electric-field vector

Growing community of inventors

Hsinchu, Taiwan

Ping-Chung Chung