Realtek Semiconductor Inc.

Ping-Chia Wang

Chao-Min Lai

Han-Chieh Hsieh

Hung-Wei Wang

Shou-Te Yen

Tang-Hung Chang

Tang-hung Chang

Han-chieh Hsieh

A control device and a circuit board are provided. The control device can cooperate with the circuit board, and includes a ball grid array. The ball grid array includes a plurality of power balls and a plurality of ground balls, which are jointly arranged in a ball region. The power balls and the ground balls are respectively divided into a plurality of power ball groups and a plurality of ground ball groups. One of the ground ball groups includes two ground balls and is adjacent to a power ball group. A ball pitch between the two ground balls is greater than that between one of the power balls and one of the ground balls adjacent to each other. The circuit board includes a contact pad array corresponding to the ball grid array of the control device so that the control device can be disposed on the circuit board.

Control device and circuit board

A signal processing circuit includes: a printed circuit board (PCB) including a first surface layer, a second surface layer, a first reference layer, and a second reference layer, wherein the first and second surface layers are positioned on opposing side of the PCB while the first reference layer and the second reference layer are positioned between the first and second surface layers; a memory chip positioned on the first surface layer; a controller chip positioned on the second surface layer; a first set of signal lines arranged on the first surface layer and coupled with the memory chip, wherein all signal lines in the first set of signal lines does not cross each other; and a second set of signal lines arranged on the second surface layer and coupled with the controller chip, wherein all signal lines in the second set of signal lines does not cross each other.

Signal processing circuit capable of avoiding cooperating memory chip from performance degradation

An electronic apparatus and a circuit board thereof are provided. The electronic apparatus includes a control device that can operate with the circuit board, and includes a ball pad array. The ball pad array includes a plurality of power ball pads and a plurality of ground ball pads, which are arranged in the same pad arrangement region. At least a portion of the power ball pads and at least a portion of the ground ball pads are arranged in an alternate manner. The circuit board includes a solder pad array corresponding to the ball pad array of the control device so as to be disposed with the control device.

Electronic apparatus and circuit board thereof

Growing community of inventors

Hsinchu, Taiwan

Ping-Chia Wang