Industrial Technology Research Institute

Pin-Hao Hu

Min-Kai Lee

Yu-Chung Lin

Yung-Hsing Wang

Shao-Chuan Lu

Mao-Chi Lin

Chien-Jung Huang

Sung-Ho Liu

Chien-Sheng Liu

Yu-Hsiu Chang

Chih-I Wu

Shih-Ming Lin

Kun-Wei Lin

Meng-Che Tsai

Ying-Hui Yang

Yang-Cheng Lin

Po-Huan Chou

Shun-Sheng Ke

Hsin-Yu Chang

Hsuan-Chang Lee

Fu-Lung Chou

Yu-Sheng Liu

Kuang-Yao Huang

Chia-Chao Chung

A laser processing system for a glass workpiece comprises a frame with a first laser module thereon, a modifying device, and a blanking device. The blanking device comprises a second laser module, a hollow support element, a clamping module disposed on the frame, a heater disposed on the hollow support element, and a cooler connected to the clamping module. A method adapted to the system comprises a modifying process, a determining process, and a blanking process. In the modifying process, a first laser beam is irradiated to the glass workpiece along a processing contour line to intermittently modify the glass workpiece. According to the determining process, the blanking process is processed to have a crack being generated in a modified portion of the glass workpiece, wherein the crack divides the glass workpiece into an outer area and an inner area, and changes a temperature of the glass workpiece to have the glass workpiece being deformed, so that the outer area and the inner area are separated.

Laser processing system and method for glass workpiece

A method of fabricating a substrate having a through via includes: providing a carrier board having a release layer thereon; attaching the substrate onto the carrier board via the release layer; applying a light beam to the substrate to form a first blind hole in the substrate, wherein the first blind hole penetrates a first surface and a second surface of the substrate; performing an enlargement process on the first blind hole to form a second blind hole; forming a through via in the second blind hole; and performing a de-bonding process to release the substrate having a through via from the carrier board.

Substrate having through via and method of fabricating the same

A laser uniformly machining apparatus and method thereof are provided. The apparatus includes a laser unit, a shaping element, a collimating element, a scaling element and a focusing element. The laser unit provides a laser beam for machining. The shaping element shapes the laser beam into an annular beam. The collimating element modifies the direction of the annular beam in accordance with the direction of an optical axis to turn the annular beam into a collimated annular beam. The scaling element adjusts the collimated annular beam in accordance with a scaling ratio to produce a scaled annular beam. The focusing element focuses the scaled annular beam. The scaled annular beam is produced by the scaling element to form a focused beam having a uniformly distribution of light intensity in the direction of the optical axis.

Laser uniformly machining apparatus and method

A light emitting method includes passing a laser beam through at least one offset assembly and a focusing assembly in sequence, and actuating, by a control-manipulating mechanism, the offset assembly to cause the laser beam to be offset, so that the laser beam can quickly produce a controllable opening of any shape in a drilling process.

Light emitting method and light emitting device

A laser machining system and a method thereof are disclosed. The disclosed laser machining system comprises a laser generator, an array photo detector, a processer, and a position controller. The laser generator is configured to emit laser via a first light path onto a work piece. The array photo detector is configured to receive the thermal radiation from the work piece via a second light path, different from the first light path, to generate a thermal radiation image. The processor, electrically coupled to the laser generator and the array photo detector, is configured to calculate a temperature centroid of the thermal radiation image and generate a distance control signal according to the temperature centroid. The position controller, electrically coupled to the processor, is controlled by the distance control signal to make a present distance between the laser machining system equal to a working distance.

Laser machining system utilizing thermal radiation image and method thereof

An automatic focusing apparatus and a method thereof are provided. The apparatus includes a light source, an optical imaging unit, a photo-sensor and a focusing regulation unit. The optical imaging unit includes an object lens and a beam splitter. The beam splitter divides a reflecting beam into a first sub-beam and a second sub-beam. The optical imaging unit has a first imaging optical path and a second imaging optical path with different imaging precisions corresponding to the first sub-beam and the second sub-beam, respectively. The photo-sensor detects a defocus position of the object. The focusing regulation unit adjusts the distance between the object and the object lens and selects an imaging precision, so that the defocus position of the object is placed within the imaging precision of the first optical path and the imaging precision of the second optical path in sequence.

Automatic focusing apparatus and method

A focal position detecting apparatus, for detecting a focusing condition and a tilting condition of an object, includes a planar beam generating module, an optical system, an optical sensor and a cylindrical lens. The planar beam generating module generates a planar light beam along a first path. The optical system is disposed on the first path, wherein the planar light beam, reflected by the object, passes through the optical system along a second path. The optical sensor is disposed on the second path. The cylindrical lens is disposed on the second path between the optical system and the optical sensor and an axis of the cylindrical lens is perpendicular to the second path. The planar light beam passes through the optical system and the cylindrical lens along the second path, before it is incident on the optical sensor to form a linear light spot for determining defocusing degree.

Focal position detecting method

A method of focus and a focusing apparatus and a detecting module are provided. The detecting module includes an ellipse curved-surface reflection device and a light detector. The ellipse curved-surface reflection device has a beam gate, a first focus and a second focus. A light beam is focused by a light focusing device, and is projected on a surface of an object to be detected through the beam gate. The ellipse curved-surface reflection device reflects the light beams reflected or scattered by the object. The light detector is disposed on the second focus for receiving the light beam reflected by the ellipse curved-surface reflection device to generate a detecting result, by which a distance between the light focusing device and the surface of the object to be detected is adjusted, so that the light beam is correctly focused on the surface of the object.

Method of focus and automatic focusing apparatus and detecting module thereof

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Kaohsiung, Taiwan

Pin-Hao Hu