U.S. Philips Corporation

Pieter Van Pelt

Gerardus J Lippits

Jacob Wijdenes

A method of applying a resist pattern on a substrate and resist material mixture. Resist materials which are applied in accordance with a specific resist pattern are employed in the production of integrated circuits. It has been found that the addition of a certain type of negative-working resist material, namely polystyrene and polystyrene derivatives, to positive-working resist materials results in a resist material mixture having an increased resistance to plasma etching.

Method of applying a resist pattern on a substrate, and resist material

A method of manufacturing an optically readable information carrier in which a substrate 1 which is provided on at least one surface with a material which is sensitive to deep ultraviolet light having a wavelength from 190-300 nm, is exposed to deep ultraviolet light via a contact mask 2 which on one side has a layer 4 of a material which is not permeable to deep ultraviolet light in which an information track 5, 6 has been provided, after which the exposed plate is developed and if desired is provided with a reflection layer.

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Sunnyvale, CA, United States of America

Pieter Van Pelt