Akzo Nobel N.v.

Akzo N.v.

Amp-akzo Lin Lam Vof

Amp-akzo Linlim Vof

Pieter H Zuuring

Erik Middelman

Jan Andre Schutyser

Antonius Johannes Buser

Hendrik J Slots

Hendrik J Slot

A process for manufacturing a multi-layer printed wire board, also referred to as a multilayer, comprising at least two electrically insulating substrates with electrically conductive traces or layers provided on at least three surfaces thereof, in which process, by means of lamination under pressure, a cured basic substrate based on a UD-reinforced synthetic material, provided on either side with traces, is combined with and bonded to a back-up substrate, wherein during the laminating process the back-up substrate is added to the basic substrate, the base substrate and the back-up substrate comprising a UD-reinforced cured core layer, the base substrate having been provided at least on the side facing the back-up substrate with a still plastically deformable (flowable) adhesive layer, and such a pressure is exerted on the laminate as to bring said back-up substrate into contact or practically into contact with the conducting traces of the basic substrate, and the space between these traces is filled with the adhesive material, so bonding the basic substrate and the back-up substrate.

Method of manufacturing a multilayer printed wire board

Method of manufacturing a UD-reinforced PWB laminate

A process for manufacturing a multi-layer printed wire board, also referred to as a multilayer, comprising at least two electrically insulating substrates with electrically conductive traces or layers provided on at least three surfaces thereof, in which process, by means of lamination under pressure, a cured basic substrate based on a UD-reinforced synthetic material, provided on either side with traces, is combined with and bonded to a back-up substrate, wherein during the laminating process the back-up substrate is added to the basic substrate, the back-up substrate comprising a UD-reinforced cured core layer provided at least on the side facing the conducting traces of the basic substrate with a still plastically deformable (flowable) adhesive layer, and such a pressure is exerted on the laminate as to bring said cured core layer of the back-up substrate into contact or practically into contact with the conducting traces of the basic substrate, and the space between these traces is filled with the adhesive material, so bonding the basic substrate and the back-up substrate.

Printed wire boards and method of making same

A polymeric material used in laminates with metal comprises an interpenetrating polymer network composed of a cyclic moiety-containing pollyallyl compound optionally with an aromatic difunctional compound (co)polymerized and cross-linked in the presence of a free radical initiator, and an epoxy resin cross-linked with a polyhydric phenol.

Interpenetrating network of ring-containing allyl polymers and epoxy

A polymeric material used in laminates with metal-comprises an interpenetrating polymer network composed of a cyclic moiety-containing pollyallyl compound optionally with an aromatic difunctional compound (co)polymerized and cross-linked in the presence of a free radical initiator, and an epoxy resin cross-linked with a polyhydric phenol.

Polymeric materials comprising an interpenetrating network (IPN) prepared from allyl polymers and epoxy resins. The allyl polymers are crosslinked under the influence of a radical initiator, the epoxy resin is crosslinked by a curing agent. The curing agent is a cyclic anhydride containing a polymerizable double bond. The two networks are interlinked as a result of the double bond being involved in the curing reaction of the allyl polymers. The cyclic anhydride preferably is maleic anhydride. Preferred IPN's are prepared form triallylcyanurate or triallylisocyanurate-based allyl polymers and phenol-type epoxy resin.

Growing community of inventors

Nijmegen, Netherlands

Pieter H Zuuring