Nanda Technologies Gmbh

Imec

Pierre-Yves Guittet

Lars Markwort

Sandip Halder

Christoph Kappel

Reza Kharrazian

Anne Jourdain

A wafer inspection method comprises imaging a full surface of the wafer at an imaging resolution insufficient to resolve individual microstructures which are repetitively arranged on the wafer. A maskis applied to the recorded image and unmasked portionsof the image are further processed by averaging. The unmasked portionsare selected such that they include memory portions of the wafer.

Method of inspecting and processing semiconductor wafers

A method of manufacturing a plurality of semiconductor wafers comprising micro-inspecting at least one location within at least one micro-inspected pattern field and determining at least one parameter value representing a property of the wafer at the micro-inspected location, macro-inspecting a plurality of locations within the at least one micro-inspected pattern field and determining, for each macro-inspected location of the macro-inspected pattern field, at least one parameter value representing the property of the wafer at the macro-inspected location based on the light intensity recorded for the macro-inspected location and on the at least one parameter value representing the property of the wafer at the micro-inspected location of this pattern field.

Methods of inspecting and manufacturing semiconductor wafers

A method of inspecting a semiconductor substrate having a back surface and including at least one piece of metal embedded in the substrate comprises directing measuring light towards the back surface of the substrate and detecting a portion of the measuring light received back from the substrate. The method also includes determining a distance between the piece of metal and the back surface based upon the detected measuring light received back from the substrate.

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Munich, Germany

Pierre-Yves Guittet