Average Co-Inventor Count = 2.02
ph-index = 7
The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.
Company Filing History:
1. International Business Machines Corporation (25 from 164,108 patents)
2. Western Digital Technologies, Inc. (14 from 5,310 patents)
3. Globalfoundries Inc. (1 from 5,671 patents)
40 patents:
1. 12412598 - Media underlayer structure for heat-assisted magnetic recording and media fabrication methods therefor
2. 12308056 - Magnetic recording medium with magnesium-titanium oxide (MTO) layer formed using pulsed direct current sputter deposition
3. 12159653 - Data storage device with laser write bias optimization using disk thermal-magnetic response mapping in heat-assisted magnetic recording
4. 12087339 - Magnetic recording medium with multiple soft underlayers and magnetic recording apparatus for use therewith
5. 12073856 - Data storage device with laser pre-bias optimization using disk thermal-magnetic response mapping in heat-assisted magnetic recording
6. 11869556 - Heat-assisted magnetic recording (HAMR) medium with optical-coupling multilayer between the recording layer and heat-sink layer
7. 11437064 - Heat-assisted magnetic recording (HAMR) medium with optical-coupling multilayer between the recording layer and heat-sink layer
8. 11423939 - Data storage device detecting write pole degradation for magnetic write head
9. 11276432 - Data storage device measuring HAMR media distributions
10. 11257525 - Data storage device predicting failure of near field transducer based on slope of thermal gradient
11. 11043318 - Multi-layer magnetic nanoparticles for magnetic recording
12. 10796719 - Heat-assisted magnetic recording (HAMR) medium with multilayered overcoat
13. 10738174 - Aqueous soluble ferrimagnets stabilized by block copolymers
14. 10614835 - Methods for fabricating magnetic writer structures using post-deposition tilting
15. 10276202 - Heat-assisted magnetic recording (HAMR) medium with rhodium or rhodium-based alloy heat-sink layer