Thomson Licensing

Interdigital Ce Patent Holdings

Pierre-Marie Morin

Jean-Marc Le Foulgoc

Dominique Lo Hine Tong

Didier Caban

The disclosure relates to a grounding component for electrically grounding an electronic component comprising an electrically conductive part. In some embodiments, the grounding component comprises: a first positioning element adapted to be positioned on an external face of the electronic component, the external face intended to be at least partially accessible from an outside of a device once the electronic component is installed in the device; a second positioning element adapted to be positioned on a face adjacent to the external face of the electronic component; a first contact element, which is electrically conductive and adapted to come into contact with the electrically conductive part of the electronic component; a second contact element, which is electrically conductive and adapted to come into contact with at least one electrically conductive part of another component of the device, when the electronic component is installed in the device; the first contact element and the second contact element being adapted to be in electrical contact, the grounding component being adapted to leave completely free access to the other faces of the electronic component which are adjacent to the external face.

Electrical grounding component and corresponding electronic board and electronic device

According to the invention, the box for packaging an object, comprising at least two upper edges, comprising:

Growing community of inventors

Sainte Gemmes sur Loire, France

Pierre-Marie Morin