Kingpak Technology Inc.

Pierre Liu

Chen Pin Peng

An integrated circuit package comprises a substrate having an upper surface, a lower surface, and a long slot penetrating from the upper surface to the lower surface. The lower surface is formed with a wiring regioins arranged at side of the long slot, and the wiring regions formed with a plurality of connection points. A glue layer is coated on the upper surface of the substrate and as arranged at the periphery of the long slot. The integrated circuit has a first surface formed with a plurality of bonding pads and is adhered to the glue layer. The wires, each of which is arranged within the long slot of the substrate electrically connected the bonding pads of the integrated circuit to the connection points of the substrate. The first compound layer is filled within the long slot of the substrate to protect the wires.

Integrated circuit package having a resistant layer for stopping flowed glue

A small memory card with a monitor includes a substrate, at least one memory chip, at least one monitor, and a glue layer. The substrate is formed with an upper surface and a lower surface, the upper surface is formed with a plurality of connected points and a plurality of golden fingers electrically connected to the plurality of connected points. The substrate is used to arrange in an electric device, the memory chip, which is mounted on the upper surface of the substrate, electrically connected to the plurality of connected points of the upper surface. The monitor is mounted on the side of the upper surface of the substrate, so that the aspect and location of the plurality of the golden fingers may be recognized. The glue layer is encapsulated and protected the memory chip. Thus, the display of the monitor may be recognized the operating aspect.

Growing community of inventors

Hsinchu Hsien, Taiwan

Pierre Liu