Bostik Sa

Pierre Gerard

Nicolas Sajot

Christophe Notteau

Anne Bardiot

The present invention relates to hot-coextrudable hot-melt pressure-sensitive adhesives particularly suitable for the production of multilayer films intended for what are called 'repositionable' packages that are opened and reclosed easily. The films used in these packages comprise at least three layers, namely an outer layer intended to be complexed thereafter, a sealing and separable layer, defining all or part of the internal surface of the package, and between them a hot-melt adhesive layer that joins them together. In this type of package, the adhesive plays an essential role insofar as, once the package has been opened by the end user, the quality of the reclosure and of the reopening will depend on the performance of the adhesive, which is of course a pressure-sensitive adhesive, that is to say an adhesive that adheres simply by manual pressure.

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Selles sur Cher, France

Pierre Gerard