Apple Inc.

Pierpaolo Lupo

Manoj Vadeentavida

Kishore N Renjan

Bilal Mohamed Ibrahim Kani

Kyusang Kim

David M Kindlon

Praveesh Chandran

Benjamin J Grena

Prashanth S Holenarsipur

Yuta Kuboyama

Vinodh Babu

Fabric may include one or more conductive strands. An insertion tool may insert an electrical component into the fabric during formation of the fabric. The electrical component may include an electrical device mounted to a substrate and encapsulated by a protective structure. An interconnect structure such as a metal via or printed circuit layers may pass through an opening in the protective structure and may be used to couple a conductive strand to a contact pad on the substrate. The protective structure may be transparent or may include an opening so that light can be detected by or emitted from an optical device on the substrate. The protective structure may be formed using a molding tool that provides the protective structure with grooves or may be molded around a hollow conductive structure to create grooves. An electrical component mounted to the fabric may be embedded within printed circuit layers.

Fabric-mounted components

Temperature sensor packages and methods of fabrication are described. The temperature sensor packages in accordance with embodiments may be rigid or flexible. In some embodiments the temperature sensor packages are configured for touch sensing, and include an electrically conductive sensor pattern such as a thermocouple or resistance temperature detector (RTD) pattern. In some embodiments, the temperature sensor packages are configured for non-contact sensing an include an embedded transducer.

Packaging technologies for temperature sensing in health care products

Optical packages and methods of fabrication are described. In an embodiment, a controller chip is embedded along with optical components, including a photodetector (PD) and one or more emitters, in a single package.

Embedded packaging concepts for integration of ASICs and optical components

Optical sensor modules and methods of fabrication are described. In an embodiment, an optical component is mounted on a module substrate. In an embodiment, a pillar of stacked wireballs adjacent the optical component is used for vertical connection between the module substrate and a top electrode pad of the optical component.

Miniaturization of optical sensor modules through wirebonded ball stacks

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Singapore, Singapore

Pierpaolo Lupo