Societa' Italiana Resine S.i.r. S.p.a.

Piero Paparatto

Silvio Vargiu

Antonio Parodi

Beppino Passalenti

Giorgio Brumat

Molding composition comprising from 10 to 50 wt.% of the polycondensation product of an alkylene glycol or a mixture of the latter with up to 20 wt.% of 2,2'-bis(4-hydroxycyclohexyl)propane or a halogenated derivative thereof, with an ethylenically unsaturated dicarboxylic acid and a saturated dicaboxylic acid, having a melting point of at least 60.degree. C, an acid value of less than 50 and a Gardner viscosity from Y to Z.sub.3, from 0.2 to 2 wt.% of organic peroxide with a decomposition temperature above 70.degree. C, and an inert filler. The resulting molded articles are particularly useful in the electrical and electronic fields.

Moulding compositions including an unsaturated polyester

Molding composition comprising an inert filler, from 0.2 to 2 wt.% of an organic peroxide with a decomposition temperature above 70.degree. C, from 0.5 to 10 wt.% of an amide of an unsaturated aliphatic carboxylic acid, and from 10 to 50 wt.% of unsaturated polyester A and/or unsaturated polyester B, wherein said polyester A is the polycondensation product of 2,2'-bis(4-hydroxycyclohexyl)propane or a halogenated derivative thereof with an unsaturated dicarboxylic acid, and said polyester B is the polycondensation product of an alkylene glycol with an unsaturated dicarboxylic acid and a saturated dicarboxylic acid. The resulting molded articles are particularly useful in the electrical and electronic fields.

Moulding compositions including unsaturated polyesters and an amide of

Molding composition comprising from 10 to 50 wt.% of the polycondensation product of 2,2'-bis(4-hydroxycyclohexyl) propane or a halogenated derivative thereof, and maleic or fumaric acid, having a melting point above 70.degree. C, an acid value of less than 50 and a Gardener viscosity from Y to Z.sub.3, from 0.2 to 2 wt.% of an organic peroxide which decomposes at a temperature above 70.degree. C, and an inert filler. The resulting molded articles are particularly useful in the electrical and electronic fields.

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Milan, Italy

Piero Paparatto