Rockwell International Corporation

Honeywell G.m.b.h.

Pierino I Zappella

William Richard Fewer

Angel Antonio Pepe

Frank John Woolston

Jay Arthur Messner

John Whittier Slemmons

Patrick Jordan Redmond

Eugene J Babcock

A microbeam interconnection method is provided to connect integrated circuit bond pads to substrate contacts. Conductive leads (microbeams) are releasably formed, by a process such as electroplating or vacuum deposition, over a release layer deposited on a ceramic, glass or similar carrier. The microbeam material adheres only very weakly to the release layer. After the inner ends of the microbeams have been bonded to IC bond pads, such as by flip chip bump bonding, and the integrated circuit has been fully tested, the IC is lifted away from the carrier, causing the microbeams to peel away from the release layer. After straightening the microbeams against a flat surface, the outer ends of the microbeams may then be bonded to contacts on an MCM or other substrate. The method permits full electrical testing at speed and high speed bonding. The method significantly reduces mechanical stresses in interconnect bonds and thereby improves integrated circuit reliability.

Microbeam assembly and associated method for integrated circuit interconnection to substrates

A method is provided for supporting the mechanical members of a micro-electronic substrate during the manufacture of the substrate into a micro-mechanical or micro-electromechanical device. The method provides supporting material that surrounds the various mechanical members of the micro-electronic substrate and stabilizes these mechanical members during manufacture. The method also facilitates precise photolithographic as well as other microfabrication techniques. Specifically, the method provides support material that surrounds the perimeter of the micro-electronic substrate and that has a surface that is coplanar with one surface of the micro-electronic substrate. Photoresist or other materials can then be deposited, such as by spinning, on the surface of the micro-electronic substrate such that the edges of the photoresist or other materials lie upon the supporting material. By placing the outer edges of the photoresist or other material on the surface of the support material, the surface of the micro-electronic substrate remains planar for subsequent photolithographic or other microfabrication procedures. An intermediate micro-electronic device assembly is also provided in which a mechanical member, such as a membrane, is supported by the supporting material.

Method for supporting during fabrication mechanical members of semi-conductive dies, wafers, and devices and an associated intermediate device assembly

The invention uses transferable solder bump connection techniques in combination with a disposable test board to test and burn-in 'as received' (i.e., untested) dies. Using transferable solder bumps, a die is first attached to the top of a disposable test board. The test board can be designed to allow 100% functional testing of the die as well as burn-in. Dies that successfully complete the test and burn-in process are considered to be 'known good dies.' Next, heat is applied to remove the known good die from the test board. A property of the invention is that solder bumps transfer with the die such that it can be used immediately in a flip-chip configuration and affixed to a MCM or other circuit board.

Transferable solder bumps for interconnect and assembly of MCM substrates

Method and apparatus for using deep ultraviolet excimer laser beams to dice semiconductor substrates, such as sapphire, with or without integrated circuitry, by establishing guided relative motion between the beam and the substrate to achieve ablative photodecomposition with the angle between the beam and the substrate being approximately five (5) degrees out of normal.

Method and apparatus for dicing semiconductor substrates using an

Method for dicing semiconductor substrates using an excimer laser beam

An improved method of forming metal contact bumps for infrared detector array includes depositing a thick layer of positive organic photoresist, and exposing the entire layer to light. A second, substantially thinner layer of photoresist is then applied, and exposed with a pattern of light corresponding to the contact bumps desired. The photoresist is developed to resolve the pattern in the top thin film, and the underlying thick resist is isotropically developed down to the substrate surface and under a portion of the remaining unexposed top layer. the metal to form the contact bumps is then deposited, preferably by evaporative deposition. The overhanging edges of the top layer of photoresist prevent continuous metal step coverage between the surface of the photoresist layer and the bumps formed on the substrate surface in the cavity. The remaining photoresist is then dissolved, and the metal deposited on the surface of the second layer is readily removed.

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Garden Grove, CA, United States of America

Pierino I Zappella