Texas Instruments Corporation

Wistron Corporation

Pi-Chiang Huang

Yuh-Harng Chien

Hao-Chun Hsieh

Bo-Hsun Pan

Chang-Lung Chen

Steven Alfred Kummerl

Chih-Chien Ho

Hung-Yu Chou

Frank Yu

Chung-Hao Lin

Sheng-Wen Cheng

Dong-Ren Peng

Stanley Chou

In some examples a semiconductor chip package includes a conductive terminal. In addition, the semiconductor chip package includes a die pad including a top side and a recess extending into the top side. The die pad is downset relative to the conductive terminal. Further, the semiconductor ship package includes a semiconductor die positioned within the recess, wherein the semiconductor die has an outer perimeter, and a solder fillet engaged within the recess and with the outer perimeter of the semiconductor die. Still further, the semiconductor chip package includes a wire bond coupled to the semiconductor die and the conductive terminal, and a mold compound covering the conductive terminal, the wire bond, the die pad, and the semiconductor die.

Semiconductor die mounted in a recess of die pad

An electronic device includes a package structure with opposite first and second sides spaced apart along a first direction, opposite third and fourth sides spaced apart along a second direction, opposite fifth and sixth sides spaced apart along a third direction, the first, second, and third directions being orthogonal to one another. A set of first leads extend outward from the first side along the first direction, a set of second leads extend outward from the second side along the first direction, and a thermal pad includes a first portion that extends along a portion of the fifth side, and a second portion that extends along a portion of the third side to facilitate cooling and visual solder inspection when soldered to a host printed circuit board.

Electronic device with three dimensional thermal pad

A process apparatus capable of pushing a panel-shaped object includes a process apparatus and at least one panel-shaped object. The process apparatus includes a carrying fixture and a separating fixture. The carrying fixture has a top surface and a bottom surface opposite to each other and has at least one positioning pillar. The separating fixture has a pushing portion. The panel-shaped object has at least one positioning hole and is carried on the top surface. The positioning pillar is inserted into the positioning hole to position the panel-shaped object. The pushing portion is adapted to move from the bottom surface toward the top surface and protrude out of the top surface, such that the panel-shaped object is pushed up by the pushing portion to be separated from the carrying fixture. In addition, a process method adapted to the process apparatus capable of pushing a panel-shaped object is also provided.

Process apparatus capable of pushing panel-shaped object and process method thereof

The disclosure provides a feeder system, for providing multiple materials from a tube, including a transportation platform and a material guiding carrier. The material guiding carrier is mounted on the transportation platform. The material guiding carrier includes a material input portion and a material output portion. A material output opening of the tube is located at the material input portion. The materials from the tube are conveyed to the material guiding carrier by the transportation platform. At least two guiding members are mounted on the material guiding carrier for matching the tube in an adjustable manner to guide the materials from the material input portion to the material output portion along a material feeding direction. The material feeding direction and an arrangement of the at least two guiding members are parallel to each other.

Feeder system and material guiding carrier thereof

Growing community of inventors

Taipei, Taiwan

Pi-Chiang Huang