Other

University of California

Cal Poly Pomona Foundation, Inc.

Phyllis R Nelson

Oscar Magnus Stafsudd

William J Kaiser

Ioannis Kanellakopoulos

Nicholas Bambos

Kristofer S Pister

Richard F M Smith

Amit Burstein

Richard H Cockrum

James S Kang

The present invention consists of a power supply and LED circuit arrangement for powering LED arrays such that single or multiple LED failures will have minimal affect on the utility of the LED array. The power supply consists of an analog or microcontroller-based feedback module with single/multiple feedback signals in series with a synchronous buck-boost converter followed by an optional filter and a LED array. The assembly utilizes the feedback signal, to modulate various parameters of the LED array, such as the output intensity, LED junction temperature, and chromaticity. The power supply can drive different circuit arrangements of LEDs including series, parallel, and combinations thereof. Typical feedback signals include LED current, temperature, and ambient luminance and contrast.

Computer controlled power supply assembly for a LED array

A method and system for ranging an object are disclosed. The method includes illuminating a field of view potentially including the object, synchronously receiving reflected signals from the field of view with and without illumination, capturing first and second images within an array, and generating a subtraction image using the images. One image is captured in the array while the other image is in the array. The first and second images include reflected signals from the field of view with and without illumination, respectively. The array includes first and second groups of lines that are unmasked and masked, respectively. In one exposure, the first group of lines is loaded with the first or second image. The image in the first group of lines is shifted into the second group. In another exposure, the first group of lines is loaded with the other image, which is shifted into the second group.

Method and apparatus for intelligent ranging via image subtraction

Improved microsensors are provided by combining surface micromachined substrates, including integrated CMOS circuitry, together with bulk micromachined wafer bonded substrates which include at least part of a microelectromechanical sensing element. In the case of an accelerometer, the proof mass is included within the wafer bonded bulk machined substrate, which is bonded to the CMOS surface machine substrate, which has corresponding etch pits defined therein over which the wafer bonded substrate is disposed, and in the case of accelerometer, the proof mass or thin film membranes in the case of other types of detectors such as acoustical detectors or infrared detectors. A differential sensor electrode is suspended over the etch pits so that the parasitic capacitance of the substrate is removed from the capacitance sensor, or in the case of a infrared sensor, to provide a low thermal conductance cavity under the pyroelectric refractory thin film. Where a membrane suspended electrode is utilized over an etch pit, one or more apertures are defined therethrough to avoid squeeze film damping. Accelerometers built according to the methodology are provided with a nulling feedback voltage to maintain the switch DC voltage across sensing capacitors in a null condition and to maintain high sensitivity without requiring either a precision transformer or regulated power sources in the capacitance bridge of the accelerometer.

CMOS integrated microsensor with a precision measurement circuit

Growing community of inventors

Mt. Baldy, CA, United States of America

Phyllis R Nelson