Juniper Networks, Inc.

Other

Phu Truong

Muhammad Sagarwala

Sean Kim

Katsuhiro Okamura

Attila I Aranyosi

Vu L Le

Theodor A Gutfeldt

Viktor Sokolenko

A test fixture, for a heatsink, may include a probe assembly with a thermocouple probe configured to removably contact a bottom surface of a pedestal of the heatsink, and measure a surface temperature of the heatsink. The test fixture may include an insulator housing configured to house the probe assembly and a heater block, and to insulate the probe assembly from the heater block. The heater block may be provided within the insulator housing and may be configured to provide heat to the heatsink via the bottom surface of the pedestal of the heatsink. The test fixture may include a mounting block connected to the insulator housing and configured to connect to the heatsink.

Test system for evaluating thermal performance of a heatsink

A disclosed apparatus may include (1) a power enclosure electrically coupled to a power supply module of a computing device, (2) a power connector that (A) is electrically coupled to a power cable that facilitates carrying electric current to the power supply module via the power enclosure and (B) is dimensioned to mate with the power enclosure, and (3) at least one power switch that (A) is electrically coupled to the power enclosure, (B) is configured to be engaged by at least one feature of the power connector while the power connector is fully mated with the power enclosure, and when engaged by the feature of the power connector, (C) enables electric current to flow from the power connector to the power supply module via the power enclosure. Various other apparatuses, systems, and methods are also disclosed.

Apparatus, system, and method for protecting power connectors against high-power arcing

A rack system may include a first plurality of line cards, where a particular one of the first plurality of line cards receives or sends packets via ports; a plurality of fabric cards, where a particular one of the plurality of fabric cards includes a switching fabric; a second plurality of line cards, where a particular one of the second plurality of line cards receives or sends packets via ports; a first backplane that connects the first plurality of line cards to the plurality of fabric cards; and a second backplane that connects the second plurality of line cards to the plurality of fabric cards.

Connectivity scheme and cooling scheme for a large rack system

Liquid-cooling the engine cylinder head augments air-cooling of a model car engine. This provides additional heat transfer from the engine in a location on the car chassis remote from the engine. This supplemental cooling allows improved engine performance and reduces car operating problems and damage related to high engine operating temperatures.

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San Jose, CA, United States of America

Phu Truong