Advanced Micro Devices Corporation

Phin-Chin Connie Wang

Paul Raymond Besser

Sergey D Lopatin

Matthew S Buynoski

Alline F Myers

A method of fabricating an integrated circuit can include forming a barrier material layer along lateral side walls and a bottom of a via aperture which is configured to receive a via material that electrically connects a first conductive layer and a second conductive layer, implanting a first alloy element into the barrier material layer, and implanting a second alloy element after deposition of the via material. The implanted first alloy element makes the barrier material layer more resistant to copper diffusion. The implanted second alloy element diffuses to a top interface of the via material and reduces bulk diffusion from the via material.

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Menlo Park, CA, United States of America

Phin-Chin Connie Wang