International Business Machines Corporation

Globalfoundries Inc.

Phillip W Palmatier

Glen Nelson Biggs

Charles Leon Arvin

Tracy A Tong

Freddie Torres

Joseph C Sorbello

John Joseph Garant

Suryanarayana Kaja

Christopher Lee Tessler

James Edward Fluegel

Ashwani K Malhotra

Bouwe W Leenstra

Donald M Brewer

Peter Alfred Gruber

John Peter Karidis

Russell Alan Budd

Thomas Weiss

Benjamin V Fasano

Sarah Huffsmith Knickerbocker

Kevin M Prettyman

Paul F Findeis

Karen P McLaughlin

John R Pennacchia

Robert G Haas

Sean A Allen

Jerry A Gorrell

Victor M Vitek

Stephen G Dutka

John Di Santis

Electroplating techniques including a system for treating a solution for use in an electroplating application and a method for using the system are provided. The system can have: a gas dispersing portion configured to treat the solution by dispersing a gas into the solution to control a concentration of a predetermined cation of a metal to be electroplated in the electroplating application; a filter portion configured to treat the solution by filtering the solution to remove a quantity of metal residue; and a circulation mechanism configured to divert the solution to one of a plating tool and a combination of the gas dispersing portion and the filter portion based on a result of an analysis of the solution.

System for treating solution for use in electroplating application and method for treating solution for use in electroplating application

Plating bath and well structures and methods are described to stop the organic compounds present in plating reservoir wells or bath solution from rising, i.e., climbing up the reservoir wall. An electroplating apparatus includes a vessel holding a liquid solution including metal plating material and an organic species, and a method of operating an electroplating apparatus. The apparatus is designed with plating bath and structures and methods to stop the organic compounds present in plating reservoir wells or bath solution from rising, i.e., climbing or wicking up the inner surfaces of reservoir walls, and to wash them back down on a continuous or cyclical basis in order to maintain a concentration of organic compounds in the plating solution within upper and lower specification limits.

Prevent and remove organics from reservoir wells

Electroplating techniques including an electroplating system and a method for using the electroplating system are provided. The electroplating system has: an electroplating apparatus for electroplating a workpiece, the electroplating apparatus has an electroplating tank configured to contain a solution including target organics; a first reservoir configured to receive the solution including the target organics from the electroplating tank, and to hold the solution including the target organics; a foaming mechanism configured to, in the first reservoir, separate the target organics from the solution through foaming action such that the solution with a reduced concentration of the target organics is separated from a foam including the separated target organics; and a diverting mechanism configured to selectively feed the solution with the reduced concentration of the target organics to one of the first reservoir and the electroplating tank of the electroplating apparatus.

Electroplating system and method of using electroplating system for controlling concentration of organic additives in electroplating solution

A bond metal injection tool can include a fill head having a sealed chamber for containing a molten bond metal (e.g., solder) and a gas, and a nozzle for directing a flow of the molten bond metal into cavities in a major surface of a mold. A pressure control device can controllably apply pressure within the chamber to eject the bond metal from the nozzle into the cavities. The pressure control device may also controllably reduce a pressure within the chamber to inhibit the bond metal from being ejected from the nozzle, such as when the fill head is being moved onto the mold surface from a parking location or when the fill head is being moved off the mold surface onto a parking location.

Vacuum transition for solder bump mold filling

Disclosed is an apparatus wherein an electric circuit with at least a power source, two electrodes and a plating solution is established. The plating solution comprises a solvent and, dissolved in the solvent, at least a first metal and a second metal. The power source supplies a current to the electric circuit during a plating process. The amount of electric current is above that required to achieve the overpotential for plating the first metal, but below that required to achieve the overpotential for plating the second metal such that only the first metal plates. This apparatus can be implemented, for example, in conjunction with a plating apparatus or an analysis and dosing apparatus of an electrodeposition system. In the case of an analysis and dosing apparatus, additional components further allow for the addition of that specific metal back into the plating solution. Also disclosed herein are associated methods.

Apparatuses, systems and methods that allow for selective removal of a specific metal from a multi-metal plating solution

A fill head apparatus includes at least one chamber for holding a fluid. The chamber has an outlet for expelling the fluid. A vacuum device has an inlet for a suction device adjacent to the fluid outlet. A plurality of flexible and resilient sealing devices contact a top surface of a workpiece. The sealing devices are positioned on opposing sides of the chamber outlet and on opposing sides of the vacuum device inlet, such that the sealing devices create at least a partial seal around a cavity defined by the workpiece and the cavity is beneath both the chamber outlet and the vacuum outlet.

Fill head interface with combination vacuum pressure chamber

A method is provided for making of interconnect solder bumps on a wafer or other electronic device without depositing any significant amount of tin or other solder component from the solder onto the wafer surface which tin can cause shorts or other defects in the wafer. The method is particularly useful for well-known C4NP interconnect technology. In one aspect of the invention, a reducing gas flow rate is used to remove oxides from the solder surfaces and wafer pad surfaces and is of a sufficient determined or pre-determined flow and/or chamber or mold/wafer spacing to provide a gas velocity across the solder surfaces and wafer pad surfaces so that Sn or other contaminants do not deposit on the wafer surface during solder transfer. In another aspect, the transfer contact is performed below the melting point of the solder and subsequently heated to above the melting temperature while in transfer contact. The heated solder in contact with the wafer pads is transferred to the wafer pads.

Process for making interconnect solder Pb-free bumps free from organo-tin/tin deposits on the wafer surface

A method for electroplating a film onto a substrate. Electrical power is supplied to the plating surface through electrical contact made to contact pads on the underside of the substrate. Contact to the contact pads is made within a liquid-tight region. The contact pads are connected to the plating surface through the substrate. Because the contact scheme is provided within a liquid-tight region on the underside of the substrate, the contacts do not erode or become plated, nor do they consume an area of the plating surface.

Method for electroplating a film onto a substrate

An electroplating apparatus comprising a plating tank containing electroplating solution, one or more substrates to be electroplated, and an electrical contact mechanism. The electrical contact mechanism comprises a first set of one or more conductive contacts electrically connected to a power supply and a second set of one or more conductive contacts mounted to a substrate carrier. The second set of contacts wipes against the first set of contacts when the carrier is maneuvered into and out of a plating position. At least one of the first and second sets of contacts is spring-biased. The first set of contacts may comprise one or more inverted-L-shaped, pivotable contacts, each mounted within a notch in a contact block.

Electroplating apparatus with self-cleaning contacts

A method and apparatus for electroplating a film onto a substrate. Electrical power is supplied to the plating surface through electrical contact made to contact pads on the underside of the substrate. Contact to the contact pads is made within a liquid-tight region. The contact pads are connected to the plating surface through the substrate. Because the contact scheme is provided within a liquid-tight region on the underside of the substrate, the contacts do not erode or become plated, nor do they consume an area of the plating surface.

Method and apparatus for making electrical contact to a substrate during

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Hopewell Junction, NY, United States of America

Phillip W Palmatier