International Business Machines Corporation

Globalfoundries Inc.

Phillip V Mann

Arvind Kumar Sinha

Sandra J Shirk/Heath

Mark David Plucinski

Kevin O'Connell

Bret Peter Elison

William James Anderl

Karl Stathakis

Tyler Jandt

Joseph Paul Kuczynski

Mark Kenneth Hoffmeyer

Arden Lot Moore

Matthew Stephen Doyle

Eric J Campbell

Christopher Michael Marroquin

Chelsie M Peterson

Ray Clement Laning

Sarah K Czaplewski-Campbell

Jessica R Eidem

David Paul Barron

Marvin Miles Misgen

Brandon R Christenson

Matthew Tant Richardson

Tyler Smith

Milnes P David

Stephen Peter Mroz

Howard Victor Mahaney, Jr

George Russell Zettles, Iv

Kory W Weckman

John Ryan Harris

Charles J Archer

Michael S Gordon

Bin Cao

Timothy Jerome Tofil

Don Alan Gilliland

Layne A Berge

Howard V Mahaney, Jr

Ryan R Anderson

Michael D O'Connell

David L Johnson

Ethan E Cruz

Christopher Lee Tuma

Matthew A Walther

Pat Rosno

Brenda Berg

Elias Rosedahl

Nathan Lee Dunfee

Alexander Matos

A heat pipe system, method, and heat sink system to enhance heat transfer from a heat-generating component. The method includes generating heat with the heat-generating component. The method also includes transferring at least a portion of the heat to at least a portion of a volatile fluid within one or more heat pipes. The method further includes modifying, dynamically, an active heat transfer region of the one or more heat pipes, thereby dynamically modulating heat transfer from the heat-generating component through the one or more heat pipes.

Dynamically enhancing heat transfer through heat pipes

A connection system comprises a printed circuit board. The printed circuit board comprises a top face and a bottom face. The printed circuit board also comprises a first edge that is normal to the top face and bottom face. The printed circuit board also comprises a second edge that is normal to the top face and bottom face. The first edge face and second edge face intersect at an angle that is not a straight angle. The connection system also comprises a coplanar card-edge socket on the printed circuit board. The socket comprises a top section that interfaces with the top face of the printed circuit board along the first and second edge faces of the printed circuit board. The socked also comprises a bottom section that interfaces with the bottom face of the printed circuit board along the first and second edge faces of the printed circuit board.

Coplanar card-edge connector

Embodiments of the disclosure provide cooling systems and cooling methods for isolating temperature fluctuation in an electronics enclosure. Embodiments of the disclosure provide effective cooling of high power temperature fluctuating components and a stable reference temperature for temperature sensitive components included in a single electronics enclosure. A disclosed multiple path cooling system includes a first path for cooling power variable components and a second path to maintain stable temperature cooling for temperature sensitive components.

Isolating temperature fluctuation in an electronics enclosure

An air moving device (AMD) includes a housing that dampens noise and routes airflow. The AMD housing includes a focal-bearing surface that has an associated focal point. The focal-bearing surface routes airflow through the AMD housing and reflects and concentrates noise to the focal point. The AMD housing further includes a noise dampening structure at the focal point to reduce, absorb, and/or dampen the concentrated noise. Because the noise is concentrated, a relatively smaller size noise dampening structure may effectively or adequately reduce or dampen AMD noise. The smaller size noise dampening structure relatively reduces airflow impedance. As such, AMD housing may provide for both reduced AMD noise and relatively reduced airflow impedance therein and/or therefrom.

Acoustic dampening air moving device housing

Systems for optimizing mounting points for coaxial RF connectors, including a printed circuit board (PCB) comprising a coaxial radio frequency (RF) connector; a faceplate comprising an opening adapted to receive the coaxial RF connector; and a bushing positioned within the opening, wherein the coaxial RF connector is positioned within the bushing.

Optimizing mounting points for coaxial RF connectors

An electronic component system includes a chassis that includes a body, an electrically isolated portion, and an insulator disposed between the electrically isolated portion and the body, wherein the insulator is comprised of a first electrically insulating material. The electronic component system further includes a first electronic component mounted to the electrically isolated portion, and a second electronic component mounted to the body and electrically connected to the first electronic component.

Isolated component mounting scheme

An electronic component assembly includes a board having an electronic component, a connector mounted to the board and electrically connected to the electronic component and having an anchoring feature positioned on an exterior of the connector, and a card having another electronic component and a securing feature. The electronic component assembly also includes a movable member positioned on one of the connector or the card. The movable member is positioned in the securing feature and contacts the anchoring feature to secure the card in a seated position in the connector, or the anchoring feature includes the movable member and contacts the securing feature to secure the card in the seated position in the connector.

Card retention connector system

An electronic board assembly comprises a board comprising an electronic component and a connector mounted to the board and electrically connected to the electronic component. The connector is configured to receive an electronic card assembly, and the connector comprises an electrical contact and a friction contact. The electrical contact is configured to exert a first amount of force on the electronic card assembly when the electronic card assembly is being seated in the connector. The friction contact is configured to exert a second amount of force on the electronic card assembly when the electronic card assembly is being seated in the connector. The second amount of force is greater than the first amount of force.

A system, an article of manufacture, and a method are disclosed. The system includes a set of components in an enclosure. The set of components includes electronic devices and airflow moving components configured to maintain airflow across the electronic devices from a front plenum of the enclosure to a rear plenum of the enclosure and direct air from the rear plenum through the first heat exchanger. The set of components also includes a first heat exchanger configured to circulate a cooling liquid and a second heat exchanger configured to maintain a constant temperature of the cooling liquid, wherein the constant temperature is a temperature of the cooling liquid within a threshold distance from a selected temperature.

Constant temperature closed-loop airflow containment

To provide for high-performance communicational throughput between electronic systems, a high-performance connector pair is disclosed. The connector pair includes a pin receptacle and card edge (PRCE) connector that may be seated or connected to a pin and card edge receptacle (PCER) connector. The PRCE connector includes an edge connector, with a plurality of edge connector pads and a pin receptacle connector with a mount region connected to the printed circuit board and a receptacle portion with a plurality of conductive pin receptacles. The PRCE connector further includes a clearance between the edge connector and the receptacle portion. The PCER connector includes a pin and card edge receptacle connector with an edge socket that receives the edge connector and includes a plurality of socket pads. The PCER connector includes further includes a pin socket that receives the receptacle portion with a plurality of pins.

Combined pin and card edge connector

A thermal interface material (TIM) structure for directing heat in a three-dimensional space including a TIM sheet. The TIM sheet includes a lower portion along a lower plane; a first side portion along a first side plane; a first upper portion along an upper plane; a first fold between the lower portion and the first side portion positioning the first side portion substantially perpendicular to the lower portion; and a second fold between the first side portion and the first upper portion positioning the first upper portion substantially perpendicular to the first side portion and substantially parallel to the lower portion.

Thermal interface material structures for directing heat in a three-dimensional space

Vibration shock mitigation for components in a server rack includes a server rack comprising: a first server component chassis and a second server component chassis installed in adjacent locations within the server rack; and a chassis gap filler comprising: an elastic dampening sheet configured for placement between the first server component chassis and the second server component chassis, wherein the elastic dampening sheet is further configured to cover a portion of one side of the first server component chassis; and at least two attachment points configured to secure the elastic dampening sheet to the server rack.

Vibration shock mitigation for components in a server rack

An apparatus for cooling warm air, including a rack containing one or more ventilation slots; a reservoir connected to the rack that contains a cooling solution; and a plurality of components, located within the rack, that receive and distribute the cooling solution from the reservoir. The plurality of components consist of at least one of the following structures: one or more hollow vertical louvers, one or more hollow horizontal louvers, one or more hollow diagonal louvers, and one or more hollow cylindrical louvers. Additionally, the plurality of components may comprise a flexible material that descends from a top portion of the rack, directly below the reservoir, at the same time that an activation component causes the cooling solution to flow from the reservoir into the flexible material.

Emergency cooling device

Methods and structures are provided for implementing electronic enclosure cooling containment for concurrent maintenance actions with a top cover of the electronic enclosure removed. The structure includes a moveable airflow baffle being attached to the associated electronic enclosure. During concurrent maintenance actions, the moveable airflow baffle is moved to an open position over at least a partial length of a replaceable component, without being detached or removed from the associated electronic enclosure. During normal operations, the moveable airflow baffle hangs down over at least a partial length of a replaceable component.

Implementing electronic enclosure cooling containment for concurrent maintenance actions

Growing community of inventors

Rochester, MN, United States of America

Phillip V Mann