Veeco Instruments Inc.

Phillip Tyler

John Taddei

Kenji Michael Nulman

Jonathan Fijal

William Gilbert Breingan

James Swallow

Paul Vit

Christopher Orlando

Mark Yannuzzi

Christopher Hofmeister

Tremayne Diggs

Nicholas Baverov

Ian Rafter

A system for removing flux from openings formed in a substrate that has openings (e.g., sized 20 microns or less) formed therein includes a spay nozzle device that has a spray nozzle arm that is formed at an angle of about 45 degrees or less for discharging fluid towards the openings in the substrate for flux removal. The angle is between about 30 degrees and 45 degrees.

Apparatus and method for die stack flux removal

An apparatus for supporting and maneuvering a wafer comprises a handle having a gas inlet adapted to couple to a gas supply, a supporting surface coupled to the handle section including a frame structure having edge segments connecting at vertices and spoke elements extending from a center of the frame structure to the vertices, a gas supply channel coupled to the gas inlet that extends from the handle and branches into channels that run through the spoke elements, and a plurality of nozzles positioned at the vertices on the supporting surface and coupled to the channels in the spoke elements. Gas provided to the plurality of nozzles exits the nozzles in a stream directed parallel to the supporting surface and the stream of gas generates forces that enable wafers to be securely supported in a floating manner over the supporting surface without coming into direct contact with the supporting surface.

System and method for self-cleaning wet treatment process

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Plainview, NY, United States of America

Phillip Tyler