Cisco Technology, Inc.

Phillip S Ting

Saeed Seyed

Hong Huynh

Hsing-Sheng Liang

Michael Chern

Toan N Nguyen

Susheela Nanjunda Rao Narasimhan

Jim C Chiappe

Vic Hong Chia

Mandy Hin Lam

Duong Cu Lu

Gary L Myers

Upendranadh Reddy Kareti

Kamran Esmaily

Sridevi Iyengar

Sean Thomas

Minawati

Hong Tran Huynh

Susheela Nanjunda Rao Narasimham

In one embodiment, a heatsink mounting system includes a plurality of fasteners for attaching the heatsink to a circuit board at a location proximate to an electronic component interposed between the circuit board and the heatsink and a damping connector for attaching an overhang portion of the heatsink to the circuit board. The damping connector includes a first O-ring for positioning adjacent to an upper surface of a base of the heatsink, a second O-ring for positioning adjacent to a lower surface of the base, and a connecting member extending through aligned openings in the O-rings and the base of the heatsink. The damping connector is operable to absorb energy during vibration or shock at the heatsink to prevent flexing of the heatsink.

Heatsink mounting system with overhang damping

An apparatus is provided in one example embodiment and includes a faceplate having a plurality of slots arranged on a front portion of the faceplate, a top plate attached to a top portion of the faceplate, and a screen attached to the faceplate and the top plate. A channel may be disposed behind the faceplate and between a bottom surface of the top portion of the faceplate, a bottom surface of the top plate and a top surface of the screen. The screen may include a plurality of openings. In a specific embodiment, the apparatus may be removably attached to a removable line card of a switch. In a specific embodiment, air may be guided through the slots, by a fan operating behind the apparatus, along the channel and through the plurality of openings to one or more heat generating components on the line card.

Air flow system

A latching apparatus provides selective injection and ejection of an electronic module relative to a chassis that includes a support member. The apparatus includes a housing to be coupled to the electronic module, and a handle pivotably coupled to the housing and movable between a latched position and an unlatched position. A catch in a first position retains the handle in the latched position. An actuator is coupled to the handle and operable to move the catch to a second position. In response to movement of the actuator in a direction the same as the direction of the handle toward the unlatched position, the catch is moved to its second position. As a result, the handle is movable between the latched and unlatched positions to permit the electronic module to be injected or ejected relative to the chassis.

Latching injector/ejector

An apparatus, in accordance with particular embodiments, includes a shell comprising two substantially parallel surfaces. The apparatus further includes a plurality of connector housings mounted between the two substantially parallel surfaces. The apparatus also includes a plurality of connectors coupled to the plurality of connector housings. Each connector is configured to move along at least one axis within its respective connector housing. The apparatus further includes a plurality of cables. Each cable is configured to couple together at least two connectors. The plurality of cables are arranged between the two substantially parallel surfaces.

High connectivity platform

To increase air flow, an air intake/outtake (i.e., intake, outtake, or both) is positioned on a front surface of a housing, such as a rack-mounted computer network switch housing. The front surface includes jacks, controls, plugs, receptacles or other input/output for connection with the processor in the housing. The air intake/outtake is one or more openings on the front surface with the input/output components. In one embodiment, to avoid interference with the input/output components and increasing the height of the housing, the air intake/outtake is a slot extending most of or all of the distance between the sides of the housing and being above or below the input/output. An intermediate plate may be used to form and support the air intake/outtake.

Cooling arrangement for a rack mounted processing device

Methods and apparatus for shielding an object from relative high electromagnetic radio frequencies while allowing airflow to pass to and from the object are disclosed. According to one aspect of the present invention, a shield arrangement that shields a chassis includes at least a first plane and a second plane. The first plane has a thickness and defines a first plurality of openings that include a first opening and a second opening that are separated by at least a distance that is a function of the thickness. The second plane defines at least a third opening, and is approximately parallel to the first plane. The second plane is spaced apart from the first plane by a spacing that is a function of at least the thickness.

Providing airflow to an electronics enclosure while providing protection and shielding against electromagnetic interference

A circuit board assembly includes a motherboard defining a motherboard plane, and a daughter board defining a daughter board plane which is substantially parallel to the motherboard plane. The motherboard and the daughter board electrically connect to each other through a set of circuit board connectors. The circuit board assembly further includes a set of edge clips. Each edge clip extends outwardly from the daughter board along the daughter board plane and is configured to operate as a mounting platform through which to physically secure the daughter board to the motherboard.

Circuit board assembly having a set of edge clips for connecting multiple boards together

A panel member attaches to a frame that supports electronic circuitry. The panel member includes a mounting portion configured to mount to the frame, and a face portion coupled to the mounting portion. The face portion defines a plane and multiple openings within the plane. The panel member further includes multiple brimmed portions coupled to the face portion. Each brimmed portion (i) extends around an opening defined by the face portion and (ii) projects from that opening in a direction which is away from the plane. The use of such a panel member provides improved airflow and stagnation pressure as well as robust electromagnetic interference protection.

Techniques for providing ventilation and EMI shielding to electronic circuitry using a panel member with brimmed holes

A heat sink attachment mechanism includes a fastener having an associated compressible member. The fastener defines a flange that, as the fastener secures a heat sink to a circuit board component, is configured to contact a circuit board surface associated with the circuit board component. Contact between the flange and the circuit board minimizes the travel of the fastener relative to the circuit board component and limits the stress generated on the circuit board component or on the solder balls of a ball grid array associated with the circuit boards component by the heat sink. Also, as the fastener secures the heat sink to the circuit board component, the fastener compresses the compressible member against the heat sink, thereby causing the compressible member to expand. Expansion of the compressible member allows the compressible member to absorb changes in the stress applied by the fastener to the heat sink and circuit board component over time.

Growing community of inventors

San Jose, CA, United States of America

Phillip S Ting