Ichor Systems, Inc.

Phillip Ryan Barros

Randolph E Treur

Chris Melcer

Haruyuki Kubota

Todd Mark Cushman

A method of processing semiconductors using a fluid delivery system is disclosed in which seal inserts are utilized to fluidly connect an active component that bridges two substrate blocks.

Method of manufacturing semiconductors using fluid delivery system

A substrate block for a fluid delivery system is provided, the substrate block having an upper surface. The upper surface has an inlet substrate port and an outlet substrate port formed into the upper surface. A substrate fluid passageway extends from the inlet substrate port and the outlet substrate port. The substrate fluid passageway extends in a smooth arc which is free of corners or angular walls.

A fluid delivery system may include a substrate block having an upper surface; a first substrate port in the upper surface; a second substrate port in the upper surface; a substrate fluid passageway extending between the first substrate port and the second substrate port; a substrate ring defining the second substrate port; and a substrate seal channel formed in the upper surface and surrounding the substrate ring. An outer surface of the substrate ring may form an inner surface of the substrate seal channel. An active component may be selected from a flow controller, a pressure transducer, a flow measurement sensor, a pressure regulator, a valve, and a flow meter. The active component may comprise a lower surface; a first component port in the lower surface; a component fluid passageway; a component ring; and a component seal channel formed in the lower surface and surrounding the component ring.

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Pleasanton, CA, United States of America

Phillip Ryan Barros