Motorola Corporation

Motorola Mobility LLC

Phillip R Nensel

Paul M Pierce

Phillip E Lindeman

Mohammed Rajeek Abdul-Gaffoor

Steve C Emmert

Louis Jerome Lundell

Toshihiro Fujimura

Joel Soto

Bruce D Hillier

Katherine C Morgenroth

Glenn S Schultz

Kyu D Kim

A heat transfer device, a mobile device, and a manufacturing method for manufacturing a heat transfer device. The heat transfer device includes a first plate having a first inner surface and a first outer surface. A second plate has a second inner surface and a second outer surface. The first plate and the second plate are at least partially bonded such that an internal reservoir is defined between the first inner surface and the second inner surface. A thermal transfer fluid is contained within the internal reservoir and is in fluid contact with both the first inner surface and the second inner surface. A first wing extends from the first plate. The first wing is adapted to be coupled to a first electronic component that requires cooling. The first wing provides heat transfer from the first electronic component to the thermal transfer fluid via the first plate.

Heat transfer apparatus for a mobile device

Communication device

Portable radiotelephone

Microphone housing

Growing community of inventors

Wauconda, IL, United States of America

Phillip R Nensel