Speedfam-Ipec Corporation

Novellus Systems Incorporated

Phillip M Rayer, Ii

Ismail Emesh

Periya Gopalan

Bentley J Palmer

Andrew M Yednak, Iii

Gregory A Olsen

Christopher J Lichner

Chad J Voelkers

An electrochemical apparatus is provided which deposits material onto or removes material from the surface of a workpiece. The apparatus comprises a polishing pad and a platen which is in turn comprised of a first conductive layer in contact with the polishing pad and coupled to a first potential, a second conductive layer coupled to a second potential, and a first insulating layer disposed between the first and second conductive layers. At least one electrical contact is positioned within the polishing pad and is electrically coupled to the second conductive layer. A reservoir is provided which places an electrolyte solution in contact with the polishing pad and the workpiece. A carrier positions and/or presses the workpiece against the polishing pad.

Method and apparatus for the electrochemical deposition and planarization of a material on a workpiece surface

The present invention provides a labyrinth seal for use with a workpiece planarization apparatus, such as a chemical mechanical planarization apparatus. In accordance with one aspect of the invention, there is provided a labyrinth seal comprising a member having at least one sloped feature which is configured to inhibit a fluid from traveling into and through the labyrinth. In accordance with another aspect of the invention, there is provided a workpiece polishing apparatus including a rotary shaft assembly which comprises a housing having a plurality of interior components; a shaft extending longitudinally through the housing, wherein the shaft includes a first end connected to a motor for rotating the shaft relative to the housing; a platen connected to a second end of the shaft; and a labyrinth seal located in a space between the platen and the housing, wherein the labyrinth seal comprises a member having at least one sloped feature which is configured to inhibit a fluid from traveling into and through the labyrinth seal. In accordance with yet another aspect of the invention, there is provided a labyrinth seal having at least one sloped feature, wherein the labyrinth seal is coupled to a fluid purge system including a purge line connected to a source of pressurized fluid and terminating in the labyrinth seal.

Seal for use with a chemical mechanical planarization apparatus

The present invention relates to a vacuum system for reliably holding wafers exposed to effluents in a wafer chuck. A vacuum pump generates a vacuum communicated to a wafer chuck through a tank. The tank has a baffle for converting vapor effluent to liquid effluent from the air sucked into the vacuum system. The tank stores the liquid effluent to prevent the effluent from fouling the vacuum pump and other components. A pressure transducer is connected to the tank to detect a loss in vacuum that may indicate a lost wafer condition. A trap is placed between the tank and the vacuum pump to detect if excessive effluents have escaped from the tank and to signal that corrective action may need to be taken.

Vacuum system coupled to a wafer chuck for holding wet wafers

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Chandler, AZ, United States of America

Phillip M Rayer, Ii