Apple Inc.

Phillip Lee Mort

Michael D Hillman

Gregory L Tice

Richard Lidio Blanco

Douglas Lea Heirich

Jay S Nigen

Chad C Schmidt

Roger R Schmidt

Theodore Gerard Van Kessel

Supratik Guha

Yves Corfield Martin

Prabjit Singh

David L Edwards

Ronald Jack Smith

Sean A Bailey

Embodiments of the present invention provide a system for distributing a thermal interface material. The system includes: an integrated circuit chip; a heat sink; and a compliant thermal interface material (TIM) between the integrated circuit chip and the heat sink. During assembly of the system, a mating surface of the heat sink and a mating surface of the integrated circuit chip are shaped to distribute the TIM in the predetermined pattern as the TIM is pressed between the mating surface of heat sink and a corresponding mating surface of the integrated circuit chip.

Coupling heat sink to integrated circuit chip with thermal interface material

Method and apparatus for distributing a thermal interface material

An apparatus for conducting heat from a computer component to a heat sink. The invention may include a thermal interface material (TIM). The invention may further include a seal or gasket that at least partially encloses the TIM. The gasket may facilitate retaining the TIM within its sidewall, and thus in place on or near a computer component. Generally, the gasket may be placed between the computer component (or a silicon board or other material upon which the computer component is located) and a heat sink. An insert may be placed within the gasket and define an aperture. The chip seats in the aperture and thus is spatially located with respect to the insert. The TIM abuts both the computer component and a heat sink. A desiccant may be located within the gasket and absorb any moisture diffusing or migrating through the gasket.

Thermal interface apparatus

Growing community of inventors

Santa Clara, CA, United States of America

Phillip Lee Mort