Semiconductor Components Industries, LLC

Other

Phillip Holland

Umesh Sharma

Rong Liu

Sudhama C Shastri

Yupeng Chen

Der Min Liou

David D Marreiro

Harry Yue Gee

Yenting Wen

Ralph N Wall

Wenjiang Zeng

Ryan J Hurley

Li Jiang

Wang-Chang Albert Gu

A common mode filter coupled to a protection device. In accordance with an embodiment, the common mode filter has first and second coils, each coil having a spiral shape, a central region, an exterior region, a first terminal, and a second terminal, wherein the first terminal of the first coil is formed in a first portion of the central region, the first terminal of the second coil is formed in a second portion of the central region, and wherein the central region is laterally bounded by the first and second coils and the exterior region is not surrounded by the first and second coils. The protection device has a first terminal coupled to the first terminal of the first coil and a second terminal coupled to the first terminal of the second coil.

Method of manufacturing a common mode filter

In accordance with an embodiment, a semiconductor component, includes a common mode filter monolithically integrated with a protection device. The common mode filter includes a plurality of coils and the protection device has a terminal coupled to a first coil and another terminal coupled to a second coil.

Method for manufacturing a semiconductor component having a common mode filter monolithically integrated with a protection device

Semiconductor component and method of manufacture

Semiconductor component that includes a common mode filter and method of manufacturing the semiconductor component

A semiconductor component and methods for manufacturing the semiconductor component that includes a three dimensional helically shaped common mode choke. In accordance with embodiments, a transient voltage suppression device may be coupled to the monolithically integrated common mode choke.

Method of manufacturing a semiconductor component and structure

A common mode filter monolithically integrated with a protection device. In accordance with an embodiment a semiconductor material having a resistivity of at least 5 Ohm-centimeters is provided. A protection device is formed from a portion of the semiconductor material and a dielectric material is formed over the semiconductor material. A coil is formed over the dielectric material.

In accordance with an embodiment, a semiconductor component includes a common mode filter monolithically integrated with a protection device. The common mode filter may be composed of first, second, third, and fourth coils, wherein each coil has first and second terminals and the first coil is magnetically coupled to the second coil and the third coil is magnetically coupled to the fourth coil. The protection device has a first terminal coupled to the first terminal of the first coil and a second terminal coupled to the first terminal of the third coil. An energy storage element has a terminal coupled to the second and first terminals of the first and second coils, respectively. Another embodiment includes monolithically integrating a common mode filter with a protection device and monolithically integrating a metal-insulator-metal capacitor with the common mode filter.

A semiconductor component and methods for manufacturing the semiconductor component that includes a monolithically integrated common mode choke. In accordance with embodiments, a transient voltage suppression device may be coupled to the monolithically integrated common mode choke.

Method for manufacturing a semiconductor component that includes a common mode choke and structure

The present invention relates to a method of making a robust wafer level chip scale package and, in particular, a method that prevents cracking of the passivation layer during solder flow and subsequent multiple thermal reflow steps. In one embodiment, a passivation layer that is formed using an insulating material applied in a highly compressive manner is used. In another aspect, another layer is applied over the passivation layer to assist with preventing cracking of the passivation layer.

Method of making reliable wafer level chip scale package semiconductor devices

A prefabricated modular closet is disclosed comprising a base, an integral enclosure having sidewalls, a back wall, a front wall with an opening therein, and a ceiling, and furring attached to the exterior surface of the enclosure. An integral floor may be provided and the flooring may comprise a frame having a truss structure for enhanced rigidity. A method for assembling a wall, including an integral prefabricated closet, is disclosed in which the closet is located and secured to a floor, and then wall framing members are thereafter erected using the prefabricated closet as part of the load bearing structure and with wall panel hung directly thereon.

Prefabricated modular closet unit

A prefabricated modular closet comprising a base, an integral enclosure having sidewalls, a back wall, a front wall with an opening therein, and a ceiling, and furring attached to the exterior surface of the enclosure.

Growing community of inventors

Los Gatos, CA, United States of America

Phillip Holland