E.i. Dupont De Nemours and Company

Uniax Corporation

Dupont Displays Inc

Phillip Bailey

Boo Nilsson

Methods for creating a protective seal suitable for protecting polymer-based electronic devices, including light emitting diodes and polymer emissive displays, are disclosed together with the protected devices. The protective seal includes one or more thin films of silicon nitride (SiN) or other inorganic dielectric applied at low temperature. One or more nonreactive metal layers may be present in the protective layer as well. Other embodiments are disclosed which include a protective cover over the protective layers. These protective layers provide encapsulation with sufficient protection from the atmosphere to enable shelf life and stress life for polymer electronic devices that are adequate for commercial applications.

Encapsulation of polymer based solid state devices with inorganic materials

Encapsulation of polymer-based solid state devices with inorganic materials

This invention pertains to methods of forming a patterned metal layer in an electronic device, wherein the metal layer is in contact with an underlying organic polymeric layer (e.g., a conductive or semiconductive organic polymeric layer), which methods comprise mechanically scribing the metal layer with a mechanical scribing instrument to form the patterned metal electrode. More specifically, this invention pertains to methods of forming a patterned metal layer in an electronic device, which device comprises, in contact sequence, a support layer, an organic polymeric layer, and said metal layer, said method comprising the step of mechanically scribing said metal layer with a mechanical scribing instrument to form said patterned metal layer; wherein said mechanical scribing instrument scribes through the entire thickness of said metal layer; wherein said mechanical scribing instrument scribes through none, some, or all of the thickness of said organic polymeric layer; wherein said mechanical scribing instrument scribes through none or some, but not all, of the thickness of said support layer.

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Goleta, CA, United States of America

Phillip Bailey