Vlsi Technology, Inc.

Koninklijke Philips Corporation N.V.

Philips Semiconductors Inc.

Taiwan Semiconductor Manufacturing Comp. Ltd.

Philippe Silvestre

Roland Van Der Tuijn

Roland M Van Der Tuijin

Augusto Gallegos

A first synchronization signal is used by a master base station and a remote base station in a digital cordless communication system. The master base station generates a second synchronization signal. The second synchronization signal is used to transfer information over a transmission medium between the master base station and the remote base station. The master base station generates the first synchronization signal from the second synchronization signal. Information is transferred over the transmission medium between the master base station and the remote base station using the second synchronization signal. The remote base station generates the first synchronization signal from the second synchronization signal. The first synchronization signal is utilized by the master base station and the remote base station for digital cordless communication.

Efficient generation within a remote base station of a synchronization signal for a cordless communication system

According to an example embodiment, the present invention is directed to a configurable semiconductor device wherein the placement of bond wires and bonding pads are assembled to bond internal configuration pads at the die level. One aspect of the invention is a multiple-configuration semiconductor device that includes a die package for housing a die including functional bonding pads and including target bonding pads that are immediately adjacent to one another and designated to be connected to power or common depending on a desired configuration. A bonding wire circuit includes a first plurality of bonding wires respectively connecting the functional bonding pads to selected lead fingers, and further includes a second plurality of bonding wires connecting each of at least two of the immediately-adjacent target bonding pads to power or common. The connection of the immediately-adjacent target bonding pads to power or common determines the desired configuration of the multiple-configuration semiconductor device.

Semiconductor device arrangement having configuration via adjacent bond pad coding

Efficient generation within a remote base station of a synchronization

The present invention comprises a ringer interface circuit for generating a ringer signal for controlling a telephone ringer. The circuit of the present invention includes a first frequency divider, a second frequency divider, and a third frequency divider. The first frequency divider is adapted to receive a ringer clock signal and generate a first divider frequency output therefrom. The second frequency divider is coupled to receive the first divider frequency output and is adapted to generate a second divider frequency output using the first divider frequency output. The second frequency divider is further adapted to generate a oversampled audio frequency signal. The third frequency divider is coupled to receive the second frequency divider output and is adapted to generate a period signal using the second frequency divider output. The circuit of the present invention also includes a modulator coupled to receive the oversampled audio frequency signal from the second frequency divider and the period signal from the third frequency divider. The modulator is adapted to generate a ringer frequency output having a pulse width according to the oversampled audio frequency signal and a level setting and a period according to the period signal. The modulator is further adapted to output the ringer signal to control a telephone ringer.

Counter based ringer interface

Growing community of inventors

Callian, France

Philippe Silvestre