Atmel Grenoble S.a.

E2v Semiconductors

Other

Tracit Technologies

S.o.i.tec Silicon on Insulator Technologies

Philippe Rommeveaux

Eric Pourquier

Bernard Aspar

Louis Brissot

Marie-No&euml;lle Semeria

Gilles Simon

Alain Jutant

The invention relates to the fabrication of optical microsystems for miniature cameras or miniature matrix displays. It is proposed that N dot matrix arrays and associated circuits should be collectively fabricated, on the front of a semiconductor wafer, to produce N identical chips, with on the side of each array, external connection lands; a plate, used to collectively form N identical optical image-forming structures, each optical image-forming structure covering a respective chip and being designed to form an overall image corresponding with the whole of the matrix array of the respective chip, is fabricated collectively and placed in close contact with the front of the semiconductor wafer; through the thickness of the wafer, conductive vias extending to the contact lands are opened, and, only after these various operations, the wafer is divided into N individual optical microsystems comprising an electronic chip covered by an optical structure.

Optical microsystem and fabrication process

The invention relates to the collective fabrication of superposed microstructures, such as an integrated circuit and a protective cover. Individual structures each comprising superposed first and second elements are fabricated collectively. The first elements (for example, integrated circuit chips) are prepared on a first plate and the second elements (for example, transparent covers) are prepared on a second plate. The plates are bonded to each other over the major portion of their facing surfaces, but with no bonding of the defined zones in which there is no adhesion. The individual structures are then diced via the top on the one hand and via the bottom on the other hand along different parallel dicing lines passing through the zones with no adhesion, so that, after dicing, the first elements retain surface portions (those lying between the parallel dicing lines) that are not covered by a second element. A connection pad may thus remain accessible at this point.

Process for the collective fabrication of microstructures consisting of superposed elements

Optical microsystem and method for making same

The invention relates to very small-sized color image sensors. The sensor according to the invention is made by the following method:

Color image sensor with enhanced colorimetry and method for making same

The invention relates to the making of color image sensors for miniature cameras. The method of fabrication includes the formation on the front face of a semi-conductive wafer of a series of active zones comprising image detection circuits, each corresponding to a respective image sensor. Each active zone is surrounded by input/output pads. The wafer is transferred by its front fact against the front face of a supporting substrate. The major part of the thickness of the semiconductor wafer is eliminated, leaving a very fine semi-conductive layer including the image detection circuits on the substrate. This method is characterized in that firstly, layers of color filters are deposited and then etched on the semi-conductive layer thus thinned. Secondly, the substrate includes connection pads laid out with the same geometry as the pads of each active zone so as to come into a position facing these pads during the transfer, to solder a respective pad of the substrate to a corresponding pad of the semi-conductive wafer. Finally, the substrate is diced into individual sensors after the deposition of the color filters.

Method for making a color image sensor with pad-to-pad soldered supporting substrate

A display screen which does not have moire effects. The transparency of an intermediate subassembly, through which the observation is made, is substantially constant at the scale of an anode subassembly. The patterns of the intermediate subassemblies have a sufficiently low periodicity in at least one direction. This may be used in the production of display screens with micropoints.

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Coublevie, France

Philippe Rommeveaux