Eca Medical Instruments, Inc.

Philippe Pare

Randall Allard

Described herein are modular packaging structures and corresponding packaging methods. Packaging structures incorporating features of the present disclosure can comprise a base structure, for example a tray comprising a volume, and a backer card, which can be configured to receive one or more objects to be packaged. Differently designed backer cards can be utilized with the same base structure allowing for a modular packaging structure and preventing the need for specialized and specifically tooled trays for different products. The backer cards may interact with the base structures to form multiple compartments. These modular packaging structures allow for a great level of customizability and help mitigate the cost and labor typically required in utilizing multiple specifically tooled thermoform trays.

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Thousand Oaks, CA, United States of America

Philippe Pare