Thales

Philippe Kertesz

Franck Vouzelaud

Bernard Ledain

Daniel Caban-Chastas

Pedro Rodrigues

An electronic component includes a first set comprising an interconnect layer and an electronic circuit having a front face and a back face, which is connected to the interconnect layer by the front face, wherein the first set comprises a metal plate having a front face and a back face joined to the back face of the electronic circuit; a coupling agent between the front face of the metal plate and the back face of the electronic circuit, configured to thermally and electrically connect the metal plate to the electronic circuit; and in that the electronic component comprises: one or more layers made of organic materials stacked around the first set and the metal plate using a printed circuit-type technique and encapsulating the electronic circuit; a thermally conductive metal surface arranged at least partially in contact with the back face of the metal plate.

Moisture-resistant electronic component and process for producing such a component

A component comprises at least one support on which is fixed at least one electronic circuit, for example a circuit of MMIC type, one or more layers of organic materials stacked on the support according to a technique of printed circuit type and forming a pre-existing cavity containing the electronic circuit, the cavity being filled with a material of low permeability to water vapor such as LCP.

Moisture-resistant electronic component, notably microwave, and method for packaging such a component

The invention relates to a microwave package delimiting an interior volume, comprising a Faraday cage formed by a conducting surface surrounding the interior volume, a connection point placed outside the Faraday cage, the connection point being intended to be linked electrically to an exterior circuit, an input-output passing through the Faraday cage and linked electrically to the connection point, a base forming a face of the package, the exterior surface of the base forming a mounting surface intended to be applied to the exterior circuit, the connection point being placed on the mounting surface, so that the connection point is placed between the Faraday cage and the exterior circuit when the package is mounted on the exterior circuit. The invention applies to microwave packages used in the realms of avionics, telecommunications, space.

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Rueil Malmaison, France

Philippe Kertesz