Commissariat a L'energie Atomique Et Aux Energies Alternatives

Stmicroelectronics (crolles 2) Sas

Stmicroelectronics S.a.

Commissariat a L'energie Atomique

Commissariat À L'énergie Atomique Et Aux Énergies Alternatives

Nxp B.v.

Stmicroelectronics (grenoble) Sas

Stmicroelectronics (rousset) Sas

Delta Concept

Philippe Coronel

Claire Fenouillet-Beranger

Guillaume Savelli

Thomas Skotnicki

Pascal Fugier

Olivier Dellea

Romain Wacquez

Michel Marty

Damien Lenoble

Stephane Monfray

Olivier Thomas

Stéphane Monfray

Marc Plissonnier

Perceval Coudrain

Stéphane Denorme

Laurent Pain

Abdelkader Aliane

Joaquin Torres

Philippe Thony

Mohamed Benwadih

Pascale Mazoyer

Paul Ferreira

Yves Thomas Laplanche

Christophe Regnier

Bernard Guillaumot

Nicolas J Loubet

Olivier Jean Poncelet

Yves Morand

Didier Dutartre

François Roy

Yvon Cazaux

Mohammed Benwadih

Sami Oukassi

Frederic Gaillard

Pascal Ancey

Aomar Halimaoui

Francois Jacquet

Jean-Michel Hartmann

Bertrand Borot

Frédéric Gaillard

Sandrine Lhostis

Simon Perraud

Tristan Caroff

Alexis Farcy

Benoit Mathieu

Jean-Antoine Gruss

Jessy Bustos

Claire Fenouillet-Béranger

Robin Cerutti

Francois Leverd

Marc Piazza

Claire Gallon

Arnaud Pouydebasque

Jacqueline Bablet

François Wacquant

Simon Frederic Desage

Nicolas Dreuilles

Emilie Bernard

Christophe Constancias

Romain Gwoziecki

Olga Kokshagina

Jean-Christophe Giraudin

Jerome Gavillet

Markus Gerhard Andreas Muller

Christophe Maitre

Joël Dufourcq

Hai Trieu Phan

Serdar Manakli

Markus Müller

François Leverd

Vincent Destefanis

Fran&ccedil;ois Leverd

Christian Vizioz

Gabriel Delepierre

Anne-Laure Seiler

Stephanne Denorme

Thomas Huguet

Brice Tavel

Gilles Philippot

Philippe Candellier

Joël Hartmann

Nicolas Buffet

Claire Fenouillett-Beranger

Matthieu Bopp

Claire Benouillet-Beranger

Benjamin Dumont

Stéphanie Jacob

Arnaud c/o Koninklijke Philips Electronics NV Pouydebasque

Mohamed Bemwadih

Yves Laplanche

Simon Frédéric Desage

Sébastien Quenard

Gilbert Pitone

Chloé Guerin

A method for producing an assembly of particles bound by a substrate, including: making a compact film of solid particles floating on a carrier liquid, the solid particles potentially holding objects between them; spraying particles onto a face of the compact film opposite to the one immersed in a carrier liquid, to create a substrate-forming-skin adhering to the solid particles; and extracting an obtained assembly outside the carrier liquid.

Method for producing a substrate by spraying particles onto a compact film of solid particles on a carrier liquid

A device including a deformable shell delimiting an inner space, and a resilient band suspended in the inner space and including two ends secured to the deformable shell. The band includes a piezoelectric material to generate an electric voltage under the effect of the deformation of the shell and two electrodes for collecting the voltage. An electronic circuit for processing the voltage is arranged on the resilient band and connected to the electrodes of the resilient band.

Device with deformable shell including an internal piezoelectric circuit

A device is provided, including a deformable shell defining an inner space including at least one piezoelectric system. The piezoelectric system includes a flexible piezoelectric membrane capable of generating electric energy under the effect of a deformation to which it is submitted, a rechargeable electric power source, formed on a flexible substrate, and an electronic circuit. The electronic circuit includes a processing circuit for generating and storing data according to the electric energy generated by the piezoelectric membrane, and connected to the electric power source for its electric power supply, and a wireless transmitter connected to the processing circuit to transmit the data stored therein and connected to the electric power source for its electric power supply. Each piezoelectric system is totally arranged on and/or inside of the deformable shell.

An interface device comprises a layer of a material thoroughly crossed by metal electrodes intended to electrically connect two electronic circuits. According to the present invention, the layer of material comprises a graphene layer and the electrodes each comprise a central electrically-conductive element formed across the thickness of the graphene layer and an electrically-insulating peripheral layer, interposed between the central element and the graphene layer.

Graphene interposer and method of manufacturing such an interposer

A method for making a FET transistor, including the following steps:

Method of fabrication of a FET transistor having an overlapped gate

Method for fabricating transistors for an integrated 3D circuit, comprising:

Method for fabricating auto-aligned interconnection elements for a 3D integrated circuit

A process for depositing a compact film of particles on an internal surface of a part, including: a) placing the part in a carrier liquid; b) generating a carrier liquid stream in a hollow of the part towards a surface of the carrier liquid, to create a protuberance; c) dispensing the particles to form a compact film floating on the liquid between a contact line and an upstream front of particles; and d) transferring the film onto the internal surface by operating a relative displacement between the part and the surface of the carrier liquid, while continuing dispensing the particles on the upstream front.

Process for depositing a compact film of particles on the internal surface of a part having a hollow delimited by this internal surface

A system includes a hot source, a cold source, and a device thermally coupled between the hot source and the cold source. The device includes a thermal-mechanical transducer and a mechanical-electrical transducer. The thermal-mechanical transducer includes a band of bimetallic strips linked mechanically together by their longitudinal ends. The band partially suspended over a portion of a substrate. Each bimetallic strip has a first stable state having a first curvature and a second stable state having a second curvature opposite the first curvature, and adjacent bimetallic strips have opposite curvature.

Thermal energy harvesting optimization with bistable elements and collaborative behavior

A method for transferring objects onto a substrate, or running substrate, the objects to be transferred being placed in a transfer area containing a carrier liquid forming a conveyor, the objects being held by a compact film of particles floating on the carrier liquid of the transfer area, within which the objects are displaced with the film of particles to be transferred onto the substrate, making at least one connector on at least one of the objects, the connector being made by a substance comprising a polymerizable compound, put in contact with the object arranged within the transfer area, and then by polymerization of the substance.

Method for transferring objects onto a substrate using a compact particle film, including a step of producing connectors on the objects

Integrated circuit equipped with at least two levels of superimposed transistors, comprising: a first transistor at a first level, a first plug, a second plug and a third plug, connected to a drain region, a gate and a source region respectively of the first transistor, the first plug, the second plug and the third plug passing through an insulating layer covering the first transistor a second transistor equipped with an active zone defined in a semi-conducting layer arranged at one end of the plugs and facing the first transistor, the transistor comprising a gate arranged between the first plug and the third plug.

Superimposed transistors with auto-aligned active zone of the upper transistor

Method for producing one or more connection elements for integrated circuit including the formation of sacrificial elements passing through a porous layer formed between two superimposed levels of transistors, then the removal of the sacrificial elements through the porous layer and their replacement by a conductor material before or after having produced a higher level transistor.

Method for producing interconnections for 3D integrated circuit

A facility for depositing a film of ordered particles onto a moving substrate, the facility configured to allow deposition, onto the substrate, of a film of ordered particles escaping from a particle outlet of a transfer zone having a first width. The facility further includes an accessory device in a form of a deposit head, provided to seal the particle outlet and configured to allow the deposition, onto the substrate, of a film of ordered particles escaping from an end of a particle transfer channel of the deposit head, the end having a second width strictly lower than the first width.

Facility and method for depositing a width adjustable film of ordered particles onto a moving substrate

A method for forming a film of particles on a carrier liquid present in a receptacle, for depositing this film onto a substrate, the method including: making a film blank between a barrier and a head including a tilted ramp, the blank being obtained by dispensing particles via the tilted ramp and carried out until the particles floating on the carrier liquid occupy a space between the barrier and an upstream front of particles located on the tilted ramp; and elongating the film by continuing dispensing the particles, and moving the head to move away from the barrier, the film elongation being performed to hold a front of particles on the ramp.

Method for forming a film of particles on a carrier liquid, with movement of an inclined ramp for compressing the particles

System for converting thermal energy into electrical energy (S) intended to be arranged between a hot source (SC) and a cold source (SF), comprising means for converting thermal energy into mechanical energy () and a piezoelectric material, with the means for converting thermal energy into mechanical energy () comprising groups (GG) of at least three bimetallic strips () linked mechanically together by their longitudinal ends and suspended above a substrate (), each bimetallic strip () comprising two stable states wherein it has in each of the states a curvature, with two directly adjacent bimetallic strips () having for a given temperature opposite curvatures, with the switching from one stable state of the bimetallic strips () to the other causing the deformation of a piezoelectric material.

Thermal energy harvesting optimisation with bistable elements and collaborative behavior

A device and method recovering heat energy and converting the heat energy into electrical energy by heat-sensitive molecules to which are connected magnetic particles, with the heat-sensitive molecules able to move the magnetic particles in relation to a conductive circuit to generate an induced current in the circuit.

Device for converting heat energy into electrical energy with heat-sensitive molecules

Growing community of inventors

Barraux, France

Philippe Coronel