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Centre Suisse D'electronique Et De Microtechnique Sa

Philippe Arquint

Walter Gumbrecht

Kris A Baert

Filip Van Steenkiste

The invention presents methods and systems for plating conductive patterns which at least result in a high uniformity and avoid parasitical plating effects. A plating system is disclosed for plating conductive patterns formed at a first surface of a substrate. The system is such that exposure surfaces not to be plated is inhibited. A first electrode of the system is immersed in the plating solution while the second electrode is in contact with another than the first surface of the substrate. The conductive patterns to be plated are temporarily electrically connected with the second electrode.

System and a method for plating of a conductive pattern

The invention concerns a device comprising a first substrate and a second substrate intended to form a micro-system such as a sensor, at least one of the substrates being able to include electronic circuit components. The invention is characterised in that a layer of polymer is interposed between the first and the second substrate, in that the polymer layer includes at least one cavity which extends from the first to the second substrate and in that solder attaching means are provided in the cavity, said solder means assuring a traction resistant mechanical connection between the two substrates.

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Herzogenaurach, Germany

Philippe Arquint