Texas Instruments Corporation

Philipp Steinman

Badih El-Kareh

Scott Balster

Christoph Dirnecker

The invention relates to a stacked capacitor () comprising a silicon base plate (), a poly-silicon center plate () arranged above the base plate (), a lower gate-oxide dielectric () arranged between the base plate () and the center plate (), a cover plate () made of a metallic conductor and arranged above the center plate (), and an upper dielectric () arranged between the center plate () and the cover plate (). The cover plate () and the base plate () are electrically connected to each other and together form a first capacitor electrode. The center plate () forms a second capacitor electrode. The invention further relates to an integrated circuit with such a stacked capacitor, as well as to a method for fabrication of a stacked capacitor as part of a CMOS process.

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Richardson, TX, United States of America

Philipp Steinman