Infineon Technologies Austria Ag

Infineon Technologies Ag

Philipp Seng

Anton Mauder

Hans-Joachim Schulze

Wolfgang Scholz

Daniel Pedone

Peter Tuerkes

Joachim Mahler

Frank Dieter Pfirsch

Edward Fuergut

Armin Willmeroth

Khalil Hosseini

Martin Gruber

Thomas Basler

Stephan Voss

Erich Griebl

Hubert Rothleitner

Horst Groeninger

Christian Kasztelan

Raimund Peichl

Edward Fürgut

Rolf Gerlach

Peter Eibl

An electronic module includes a semiconductor package, and a clip connected to the semiconductor package. The clip is connected to or includes at least one fastening element which is configured to make a connection to an external heat sink.

Electronic module comprising a semiconductor package with integrated clip and fastening element

A temperature protected power semiconductor device has a substrate which includes a power field effect transistor (FET) and a thermosensitive element. The power FET has a gate electrode connected to a gate, a drift region, and first and second terminals for a load current. The load current is controllable during operation by a voltage applied between the gate and the first terminal. The thermosensitive element has a first contact connected to one of the gate electrode and first terminal of the power FET, and a second contact connected to the other one of the gate electrode and first terminal. The thermosensitive element is located close to the power FET and thermally coupled thereto. The thermosensitive element is configured to cause the power FET to reduce the load current in case of an exceedance of a limit temperature of the power FET, by interconnecting the gate and first terminal.

Power semiconductor device with integrated temperature protection

A semiconductor diode with integrated resistor has a semiconductor body with a front surface, a back surface and a diode structure with an anode electrode and a cathode electrode. A resistance layer arranged on the back surface of the semiconductor body provides the integrated resistor.

Semiconductor diode

A semiconductor device includes an anode doping region of a diode structure arranged in a semiconductor substrate. The anode doping region has a first conductivity type. The semiconductor device further includes a second conductivity type contact doping region having a second conductivity type. The second conductivity type contact doping region is arranged at a surface of the semiconductor substrate and surrounded in the semiconductor substrate by the anode doping region. The anode doping region includes a buried non-depletable portion. At least part of the buried non-depletable portion is located below the second conductivity type contact doping region in the semiconductor substrate.

Semiconductor devices and methods for forming semiconductor devices

A semiconductor diode is provided. The semiconductor diode includes a monocrystalline silicon semiconductor body including a first semiconductor region of a first conductivity type extending to a first surface of the semiconductor body and having a first maximum doping concentration, and a second semiconductor region of a second conductivity type forming a pn-junction with the first semiconductor region. The semiconductor diode further includes a polycrystalline silicon semiconductor region of the first conductivity type having a second maximum doping concentration which is higher than the first maximum doping concentration and adjoining the first semiconductor region on the first surface, a first metallization arranged on the polycrystalline silicon semiconductor region and in electric contact with the polycrystalline semiconductor region, and an edge-termination structure arranged next to the first semiconductor region. Further, a method for producing a semiconductor diode is provided.

Semiconductor diode and method for forming a semiconductor diode

A method for forming a semiconductor device includes incorporating first dopant atoms of a first conductivity type into a semiconductor substrate to form a first doping region of the first conductivity type. Further, the method includes forming an epitaxial semiconductor layer on the semiconductor substrate and incorporating second dopant atoms of a second conductivity type before or after forming the epitaxial semiconductor layer to form a second doping region including the second conductivity type adjacent to the first doping region so that a pn-junction is located between the first doping region and the second doping region. The pn-junction is located in a vertical distance of less than 5 &#x3bc;m to an interface between the semiconductor substrate and the epitaxial semiconductor layer. Additionally, the method includes thinning the semiconductor substrate based on a self-aligned thinning process. The self-aligned thinning process is self-controlled based on the location of the pn-junction.

Method for forming a semiconductor device and a semiconductor device

An embodiment of an IGBT comprises an emitter terminal at a first surface of a semiconductor body. The IGBT further comprises a collector terminal at a second surface of the semiconductor body. A first zone of a first conductivity type is in the semiconductor body between the first and second surfaces. A collector injection structure adjoins the second surface, the collector injection structure being of a second conductivity type and comprising a first part and a second part at a first lateral distance from each other. The IGBT further comprises a negative temperature coefficient thermistor adjoining the first zone in an area between the first and second parts.

Insulated gate bipolar transistor comprising negative temperature coefficient thermistor

A semiconductor device includes a chip carrier and a semiconductor die with a semiconductor portion and a conductive structure. A soldered layer mechanically and electrically connects the chip carrier and the conductive structure at a soldering side of the semiconductor die. At the soldering side an outermost surface portion along an edge of the semiconductor die has a greater distance to the chip carrier than a central surface portion. The conductive structure covers the central surface portion and at least a section of an intermediate surface portion tilted to the central surface portion. Solder material is effectively prevented from coating such semiconductor surfaces that are prone to damages and solder-induced contamination is significantly reduced.

Semiconductor device assembly including a chip carrier, semiconductor wafer and method of manufacturing a semiconductor device

A PIN diode includes a first p-area, an n-area, and in between an intermediate area on a first surface of a substrate, wherein a doping concentration of the intermediate area is lower than a doping concentration of the p-area and lower than a doping concentration of the n-area. Further, the PIN diode includes a first electrically conductive member, which is arranged on a side of the p-area, which faces away from the intermediate area, and a second electrically conductive member, which is arranged on a side of the n-area, which faces away from the intermediate area. The PIN diode is preferably separated from the substrate by an insulating layer, covered by a further insulating layer on the surface, which faces away from the substrate, and laterally surrounded by a trench filled with an insulating material, such that it is essentially fully insulated and encapsulated.

Growing community of inventors

Munich, Germany

Philipp Seng