Osram Oled Gmbh

Pictiva Displays International Limited

Philipp Schwamb

Erwin Lang

Simon Schicktanz

Richard Baisl

Johannes Rosenberger

Guenter Schmid

Karsten Diekmann

Arne Fleissner

Daniel Steffen Setz

Michael Popp

Wiebke Sarfert

Thilo Reusch

Florian Eder

David Hartmann

Sabine Szyszkowski

Evelyn Trummer-Sailer

An optoelectronic assembly including an optically active region configured for emitting and/or absorbing light, and an optically inactive region configured for component-external contacting of the optically active region is provided. The optically inactive region includes a dielectric structure and a first electrode on or above a substrate, an organic functional layer structure on the first electrode in physical contact with the first electrode and the dielectric structure, and a second electrode in physical contact with the organic functional layer structure and above the dielectric structure, wherein the organic functional layer structure at least partly overlaps the dielectric structure in such a way that the part of the second electrode above the dielectric structure is free of a physical contact of the second electrode with the dielectric structure.

Optoelectronic assembly and method for producing an optoelectronic assembly

The invention relates to an optoelectronic semiconductor component () comprising a substrate (), a first insulator layer (), and a second insulator layer (). Furthermore, the semiconductor component () comprises an organic semiconductor layer sequence () having an active area () which, during operation, generates or receives light, a first electrode () and a second electrode (), and encapsulation () which covers the organic semiconductor layer sequence () and the first insulator layer () completely and covers the second insulator layer () and the first electrode () or the second electrode () partially. Here, the first electrode () is arranged between the organic semiconductor layer sequence () and the first insulator layer (), and the second electrode () is arranged on the organic semiconductor layer sequence (), wherein the first electrode () and/or the second electrode () is/are at least partly arranged on the second insulator layer ().

Optoelectronic semiconductor component

The invention relates to an optoelectronic semiconductor component () comprising a substrate (), a first insulator layer (), and a second insulator layer (). Furthermore, the semiconductor component () comprises an organic semiconductor layer sequence () having an active area (a) which, during operation, generates or receives light, a first electrode () and a second electrode (), and encapsulation () which covers the organic semiconductor layer sequence () and the first insulator layer () completely and covers the second insulator layer () and the first electrode () or the second electrode () partially. Here, the first electrode () is arranged between the organic semiconductor layer sequence () and the first insulator layer (), and the second electrode () is arranged on the organic semiconductor layer sequence (), wherein the first electrode () and/or the second electrode () is/are at least partly arranged on the second insulator layer ().

Optoelectronics semiconductor component

A method for producing an organic electronic device is disclosed. In an embodiment the method includes applying an organic material to a substrate to form at least one organic functional layer, applying a patterned electrode material to the at least one organic functional layer by a first mask, and removing the organic material from regions which are free of the electrode material.

Method for producing an organic electronic device

An optoelectronic component is provided with a carrier; a zinc oxide layer arranged on the carrier and having the first and second regions, wherein the first region is a first electrode structure which is doped with aluminum so that the first region is transparent and electrically conductive; an organic optically functional layer structure arranged at least partially over the first electrode structure; and a second electrode structure arranged at least partially over the organic optically functional layer structure. The first and second electrode structures electrically contact the organic optically functional layer structure. The zinc oxide layer has a lower doping in the second region than the first electrode structure. The zinc oxide layer is configured in the second region as a varistor layer structure, which is arranged between the first and second electrode structures and contacts the two electrode structures. The varistor layer structure adjoins the optically transparent first region.

Optoelectronic component and method for producing an optoelectronic component

An organic optoelectronic component is disclosed. In an embodiment, an organic optoelectronic component includes an organic layer sequence having an active layer for emitting or absorbing electromagnetic radiation, a thin-film encapsulation on the organic layer sequence, an absorption layer on the organic layer sequence, the absorption layer configured to absorb and store a substance which is harmful to the organic layer sequence and a transport layer directly adjacent to the absorption layer, the transport layer configured to transport the harmful substance, wherein the transport layer has a greater diffusion coefficient and/or a higher transmission rate for the harmful substance than the absorption layer, and wherein the absorption layer has a higher storage capacity for the harmful substance than the transport layer so that the harmful substance, upon contact with the transport layer, is distributed within the transport layer and is subsequently absorbed by the absorption layer.

Organic optoelectronic component

The invention relates to an organic light-emitting component which has an organic functional layer stack () having at least one light-emitting layer, which is designed to generate light during operation of the component, a transparent first electrode () and a transparent second electrode (), which are designed to inject charge carriers into the organic functional layer stack () during operation, and a heat distribution layer (), which is applied over the electrodes () and the organic functional layer stack () and which has at least one plastic layer () and a highly heat conductive layer (), wherein the heat distribution layer () has at least one transparent sub-region () and at least one non-transparent sub-region ().

Organic light-emitting device

An optoelectronic component may include a carrier, above which a first electrode is formed. An optically functional layer structure is formed above the first electrode. A second electrode is formed above the optically functional layer structure, the second electrode extending areally over at least one part of the side of the optically functional layer structure which faces away from the carrier. An encapsulation is formed above the first and/or second electrode, the encapsulation encapsulating the optically functional layer structure. An electrically conductive contact structure is arranged in a cutout of the encapsulation on the first and/or second electrode and extends through the encapsulation, for electrically contacting the first and/or second electrode. The contact structure and the encapsulation are formed such that in interaction they encapsulate the first and/or second electrode.

An optoelectronic component and a method to operate the optoelectronic component are disclosed. In an embodiment the optoelectronic component includes an organic light-emitting diode configured to emit radiation through a main emission surface and a liquid crystal element configured to adjust a color location of the radiation, wherein the liquid crystal element is switchable into a first state and into a second state, wherein the liquid crystal element in the first state is suitable for selectively reflecting light of a first wavelength range and in the second state is transparent, and wherein the liquid crystal element is arranged on a rear side of the organic light-emitting diode facing the main emission surface so that light of the first wavelength range that is emitted towards the rear side is at least partially reflected in a direction of the main emission surface in the first state of the liquid crystal element.

Optoelectronic component

Various embodiments may relate to a method for working an apparatus having at least one electrical layer structure. The electrical layer structure includes a dielectric layer in physical contact with an electrically conductive layer and the electrical layer structure has a first electrical conductivity. The method may include forming an electrical connection to the dielectric layer of the electrical layer structure, and forming an electrical voltage profile at the electrical connection in such a way that a second electrical conductivity is formed; wherein the second electrical conductivity is greater than the first electrical conductivity. The electrical layer structure has the second electrical conductivity after the reduction of the electrical voltage profile.

Method for working an apparatus having at least one electrical layer structure, and component arrangement for working an apparatus having at least one electrical layer structure

Various embodiments may relate to an electronic structure, including at least one organic layer, at least one metal growth layer grown onto the organic layer, and at least one metal layer grown on the metal growth layer. The at least one metal growth layer contains germanium. Various embodiments further relate to a method for producing the electronic structure.

Electronic structure having at least one metal growth layer and method for producing an electronic structure

Various embodiments may relate to a method for processing an electronic component. The method includes applying a planar structure provided with predetermined separation locations to the electronic component, and removing a part of the applied planar structure, wherein removing includes separating the planar structure at the predetermined separation locations.

Method for processing an electronic component and electronic component arrangement

Various embodiments may relate to an optoelectronic component, including a carrier, a planar, electrically active region on or above the carrier; an adhesion layer on or above the electrically active region, wherein the adhesion layer at least partly surrounds the electrically active region, a cover on or above the adhesion layer, wherein a part of the adhesion layer is exposed, and an encapsulation on or above the exposed adhesion layer, wherein the encapsulation is formed from an inorganic substance or substance mixture. Further various embodiments may relate to a method for producing an optoelectronic component.

Optoelectronic component including exposed contact pad

An apparatus may include a first support covered with at least one ALD precursor and/or at least one MLD precursor, and a second support covered with at least one ALD precursor and/or at least one MLD precursor which is/are complementary to the ALD precursor and/or MLD precursor of the first support. The first support is at least partly joined to the second support by an atomic bond between the ALD precursor of the first support and the ALD precursor of the second support or between the MLD precursor of the first support and the MLD precursor of the second support in such a way that an ALD layer or an MLD layer is formed.

Device and method for producing hermetically-sealed cavities

A light-emitting organic component is specified, comprising&#x2014;an organic active region (), in which light is generated during the operation of the component, and&#x2014;an uneven light exit surface (), through which at least part of the light generated in the organic active region () emerges from the component, wherein&#x2014;a multiplicity of optical structures () which optically influence the light passing through and/or impinging on them are arranged at the uneven light exit surface ().

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Wuppertal, Germany

Philipp Schwamb