Osram Opto Semiconductors Gmbh

Ledvance Gmbh

Philipp Schlosser

Andreas Waldschik

Thomas Schwarz

Reiner Windisch

Andreas Biebersdorf

Bernd Barchmann

Dirk Becker

Björn Hoxhold

A light-emitting component has a light-emitting diode chip which emits blue light with a peak wavelength of at least 450 nm and at most 465 nm. A conversion element is arranged downstream of the light-emitting diode chip in an emission direction. The conversion element contains a green fluorescent substance and a red fluorescent substance. During operation of the component the green fluorescent substance converts a part of the blue light into green light and the red fluorescent substance converts a part of the blue light into red light. The combination of the light-emitting diode chip and the conversion element thereby emits a cold white mixed light, comprising at least a part of the blue light, the green light, and the red light, wherein the cold white mixed light has a melanopic action factor of at least 0.85.

Light-emitting component, light fixture, method for operating a light fixture, and conversion element

A method of producing optoelectronic semiconductor components includes providing a carrier with a carrier underside and a carrier top. The carrier has a metallic core material and at least on the carrier top a metal layer. A dielectric mirror is applied to the core material. At least two holes are formed through the carrier. A ceramic layer with a thickness of at most 150 &#x3bc;m at least on the carrier underside and in the holes is produced. The ceramic layer includes the core material as a component. Metallic contact layers are applied to at least subregions of the ceramic layer on the carrier underside and in the holes so that the carrier top electrically connects to the carrier underside through the holes. At least one radiation-emitting semiconductor chip is applied to the carrier top and the semiconductor chip is electronically bonded to the contact layers.

Method of producing optoelectronic semiconductor components, and optoelectronic semiconductor component

A method for producing a lighting device is provided. According to the method, a plurality of semiconductor emitters arranged alongside one another are embedded in a light-transmissive filling compound apart from a side having their electrical connections, trenches are introduced into the light-transmissive filling compound at the side having the electrical connections between at least two semiconductor emitters, the side of the light-transmissive filling compound having the electrical connections, including the electrical connections, is covered with a dielectric material, electrical lines are led through the dielectric material to the electrical connections, and at least some of the trenches are severed.

Lighting device and method for producing such a lighting device

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Wuppertal, Germany

Philipp Schlosser