National Semiconductor Corporation

Eastman-kodak Company

Texas Instruments Corporation

Foveon, Inc.

Philipp Lindorfer

Peter J Hopper

Vladislav Vashchenko

Yuri Mirgorodski

Andy Strachan

William David French

Peter B Johnson

Robert Drury

Kyuwoon Hwang

Roozbeh Parsa

Michael Mian

Constantin Bulucea

Paul Mawson

Mark Willam Poulter

Steven Hunt

Visvamohan Yegnashankaran

Andrew Derek Strachan

Prasad Chaparala

Willem J Kindt

Waclaw C Koscielniak

Byron Jon Roderick Shulver

Rob Drury

Vladislav Vashshenco

Vladislav Vashchenho

Wendy Greig

Andrew James West

Vludislav Vashchenko

Andy Strachon

The cost and size of an atomic magnetometer are reduced by attaching together a first die which integrates together a vapor cell, top and side photo detectors, and processing electronics, a second die which integrates together an optics package and a heater for the vapor cell, and a third die which integrates together a VCSEL, a heater for the VCSEL, and control electronics.

Die-sized atomic magnetometer and method of forming the magnetometer

The cost and size of an atomic magnetometer are reduced by attaching a vapor cell structure that has a vapor cell cavity to a base die that has a laser light source that outputs light to the vapor cell cavity, and attaching a photo detection die that has a photodiode to the vapor cell structure to detect light from the laser light source that passes through the vapor cell cavity.

Micro-fabricated atomic magnetometer and method of forming the magnetometer

A method of simulating an integrated circuit device under test (DUT) is provided, wherein the DUT includes a plurality of terminals. For each terminal of the DUT, a probe pulse is applied to the terminal and a reaction is recorded at the terminal and each of the other terminals to obtain values representative of reactive tails for the terminal. For each terminal, the values representative of the reactive tails obtained for the terminal are stored as an entry of a look-up table. Each entry includes n+x fields, wherein n represents a number of arguments in the entry and x represents a number of functions in the entry. For each terminal, a signal value at a selected time step is calculated.

Black box model for large signal transient integrated circuit simulation

A circuit includes multiple doped regions in a substrate. A first of the doped regions has a tip proximate to a second of the doped regions and is separated from the second doped region by an intrinsic region to form a P-I-N structure. The circuit also includes first and second electrodes electrically coupled to the first and second doped regions, respectively. The electrodes are configured to supply voltages to the first and second doped regions to reverse bias the P-I-N structure and generate light. The first doped region could include multiple tips, the second doped region could include multiple tips, and each tip of the first doped region could be proximate to one of the tips of the second doped region to form multiple P-I-N structures. The P-I-N structure could also be configured to operate in double avalanche injection conductivity mode with internal positive feedback.

High-speed avalanche light emitting diode (ALED) and related apparatus and method

Methods and structures provide galvanic isolation for electrical systems using a wide oxide filled trench, and that allows power across the system divide with a transformer, and that transmits data at a high baud rate using an optical link. The system solution allows the integration of all of these elements onto a single semiconductor substrate in contrast to currently available galvanic isolation systems that require multiple individual silicon die that are connected by wire bonds and are relatively slow.

Galvanic isolation that incorporates a transformer with an optical link and that can be integrated onto a single semiconductor substrate

A self-propelled robotic device moves through bodily and other passageways by inflating regions of an overlying bladder along the length of the robotic device in a sequence that imparts motion to the device. The regions of the overlying bladder are inflated by energizing a plurality of coils, which are surrounded by a ferrofluid, in a sequence. The ferrofluid responds to the magnetic field created by an energized coil by creating a bulge in the side wall of the overlying bladder.

Self-propelled robotic device that moves through bodily and other passageways

An on-chip inductor structure for a DC-DC power regulator circuit merges the switching transistor metallization with the inductor. Thick top level conductor metal that is used to strap the transistor array and to lower its on-state resistance is also used to extend the power inductor into the transistor array. Thus, the structure includes three basic components: a power inductor that spirals around the transistor array, the transistor array itself, and the transistor array metallization that is used to form a distributed inductance situated over the transistor array.

On-chip power inductor

A silicon-based light emitting structure is formed as a high density array of light-emitting p-n junctions that substantially increases the intensity of the light emitted in a planar region. The p-n junctions are formed using standard CMOS processing methods, and emit light in response to applied voltages that generate avalanche breakdown and an avalanche current.

Method of forming a silicon-based light-emitting structure

A micro-electromechanical system (MEMS) inductor is formed in a saucer shape that completely surrounds a magnetic core structure which is formed from a ferromagnetic material. In addition, an array of MEMS inductors can be formed by dividing up the saucer-shaped MEMS inductor into a number of electrically-isolated MEMS inductor wedges.

Method of forming a saucer-shaped half-loop MEMS inductor with very low resistance

A semiconductor technology combines a normally off n-channel channel-junction insulated-gate field-effect transistor ('IGFET') () and an n-channel surface-channel IGFET (or) to reduce low-frequency 1/f noise. The channel-junction IGFET is normally fabricated to be of materially greater gate dielectric thickness than the surface-channel IGFET so as to operate across a greater voltage range than the surface-channel IGFET. A p-channel surface-channel IGFET (or), which is typically fabricated to be of approximately the same gate-dielectric thickness as the n-channel surface-channel IGFET, is preferably combined with the two n-channel IGFETs to produce a complementary-IGFET structure. A further p-channel IGFET (, or), which is typically fabricated to be of approximately the same gate dielectric thickness as the n-channel channel-junction IGFET, is also preferably included. The further p-channel IGFET can be a surface-channel or channel-junction device.

Fabrication of semiconductor structure having N-channel channel-junction field-effect transistor

A MOS transistor and subsurface collectors can be formed by using a hard mask and precisely varying the implant angle, rotation, dose, and energy. In this case, a particular atomic species can be placed volumetrically in a required location under the hard mask. The dopant can be implanted to form sub-silicon volumes of arbitrary shapes, such as pipes, volumes, hemispheres, and interconnects.

Method of forming a circuit having subsurface conductors

Silicon-based light-emitting structure

In an ESD protection structure, dual direction ESD protection is provided by forming an n-well isolation ring around an NMOS device so that the p-well in which the NMOS drain is formed is isolated from the underlying p-substrate by the n-well isolation ring. By forming the n-well isolation ring the p-n-p-n structure of an embedded SCR for reverse ESD protection is provided. The width of the n-well isolation ring and its spacing from the NMOS drain are adjusted to provide the desired SCR parameters.

Dual direction ESD clamp based on snapback NMOS cell with embedded SCR

In a fuse-based programmable circuit block, the poly-fuse is burned out by making use of a snapback device connected in series with the poly-fuse.

Growing community of inventors

San Jose, CA, United States of America

Philipp Lindorfer