Ems-Patent Ag

Ems-Chemie Ag

Philipp Harder

Nikolai Lamberts

Ronny Ebling

Botho Hoffmann

Christian Schubert

Manfred Hewel

Etienne Aepli

Andreas Bayer

Georg Stoppelmann

Georg Stöppelmann

Mark Pfleghar

Thomas Jeltsch

Jean-Jacques Linster

Bernd Henkelmann

Felix Koch

Herbert Mossauer

The present invention relates to semi-crystalline copolyamides and to moulding compounds manufactured from same that contain at least one filler, and optionally additives in addition to the semi-crystalline copolyamide. The invention equally relates to mouldings manufactured from same.

Semi-crystalline copolyamides, moulding compounds comprising same and their use, and mouldings manufactured from same

The present invention relates to polyamide moulding compounds that contain a semi-crystalline copolyamide, at least one filler, and optionally additives. The invention likewise relates to mouldings manufacture from these moulding compounds and to the use of the moulding compounds to manufacture mouldings.

Polyamide moulding compound and its use and mouldings manufactured from the moulding compound

Disclosed are polyamide moulding compounds having a relative permittivity of no more than 3.5 at 2.45 GHz, and having the following components: (A) 25 to 80% by weight of a mixture made of at least one partially crystalline aliphatic polyamide and at least one amorphous or microcrystalline polyamide, (B) 20 to 65% by weight of at least one glass filler, and (C) 0 to 10% by weight of additives, the sum of components (A), (B) and (C) producing 100% by weight. The polyamide moulding compounds are for use in components of devices such as laptops and mobile phones.

Polyamide moulding compounds with low relative permittivity

The invention concerns polyamide moulding compound, in particular for producing heat-resistant moulded parts, having the following composition: (A) 20 to 79 wt. % of at least one partially aromatic polyamide in the form of a copolyamide which comprises 50 to 80 mol. % units formed by hexanediamine and terephthalic acid; (B) 1 to 15 wt. % of at least one impact-resistant modifier; (C) 20 to 60 wt. % of at least one carbon fibre; and (D) 0 to 5 wt. % of at least one additive, components (A) to (D) adding up to 100 wt. %.

Polyamide moulding compounds for large moulded parts

A reinforced polyamide molding composition is described, particularly for use as starting material for the production of housings for devices in the field of mobile radio technology, composed of the following components:

Reinforced polyamide moulding compositions and injection mouldings produced therefrom

A polyamide molding composition and uses thereof, and moldings produced therefrom, comprising the following components:

Polyamide moulding compositions, process for production thereof and use of these polyamide moulding compositions

A polyamide molding material is proposed, which comprises at least one partially crystalline, partially aromatic polyamide (A) and at least one amorphous polyamide (B). The polyamides (A) and (B) together make up 30-60 wt.-% of the polyamide molding material. Furthermore, the polyamide molding material comprises 40-70 wt.-% glass fibers (C) having flat cross section, 0-15 wt.-% of at least one nonhalogenated flame retardant (D), and 0-10 wt.-% further additives (E), the components (A) to (E) adding up to 100 wt.-% of the polyamide molding material. The at least one partially crystalline, partially aromatic polyamide (A) has a glass transition temperature of at least 105&#xb0; C. The polyamide molding material according to the invention is preferably distinguished in an injection-molding burr formation test in that, at a melt temperature of 320&#xb0; C. and a tool temperature of 90&#xb0; C., and a dynamic pressure of 100 bar and a holding pressure of 400 bar, at the flow path end of a mold arm having a vent gap dimension of 30 &#x3bc;m, burrs having a length G of at most 30 &#x3bc;m result. Such a polyamide molding material results in molded parts having good surface quality and low warpage when injection molded and is suitable for the production of housings or housing parts of electrical and electronic devices.

Polyamide molding material, the use thereof, and molded parts produced therefrom

Disclosed is a polyamide moulding compound suitable for producing moulded articles with improved mechanical properties, the moulding compound including A) at least one amorphous or microcrystalline polyamide, with the proviso that a test piece of polyamide A) has a light transmission according to ASTM D 1003 of at least 80% and a melting heat according to ISO 11357 of &#x3c;25 J/g, B) 20 to 85% by weight of a long fibre with a round cross-section and C) 0 to 10% by weight of at least one additive, components A) to C) adding up to 100% by weight. Also disclosed is a process for producing moulded bar granulates containing the moulding compound.

Long-fibre-reinforced polyamides

The invention relates to filled polyamide molding compounds which, in addition to a selected polymer mixture comprising two different polyamides, contain long glass fibers with a non-circular cross-sectional area. Furthermore, the invention relates to the use of such molding compounds for the production of molded articles and the molded articles themselves.

Filled polyamide molding materials

The present invention relates to reinforced polyamide molding compounds containing high-melting partially aromatic polyamides and flat glass fibers, in particular with a rectangular cross section, i.e., glass fibers with a noncircular cross-sectional area and a dimension ratio of the main cross-sectional axis to the secondary cross-sectional axis of 2 to 6, in particular 3 to 6, most especially preferably from 3.5 to 5.0. The present invention also relates to a method for manufacturing polyamide molding compounds and molded articles manufactured therefrom, i.e., in particular injection-molded parts. The inventive molded parts have a high transverse stiffness and transverse strength.

High-temperature polyamide molding compounds reinforced with flat glass fibers

Filled polyamide molding compounds which, in addition to a selected polymer mixture comprising polyamides and a flameproofing agent, contain glass fibers with non-circular cross-sections, the use of such molding compounds for the production of molded articles, and the molded articles themselves.

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Chur, Switzerland

Philipp Harder