Basf Aktiengesellschaft

Philipp Eisenbarth

Roland Peter

Jan Holoch

Thomas Folda

Gunnar Schornick

Jack D Boyd

Peter Ittemann

Anton Hesse

Lothar Franz

Rudolf Schuhmacher

Lothar Schlemmer

Gerd Linden

Thomas Allspach

Volker Altstaedt

Solid, fusible bismaleimide resins formed from a mixture of a bismaleimide and an aminophenol still contain from 70 to 90 mol % of unconverted bismaleimide and from 30 to 60 mol % of unconverted aminophenol.

Bismaleimide resin containing unreacted monomer reactants

Heat-curable resins which are suitable for fabricating carbon fiber prepregs and fiber composites by winding and resin transfer molding contain a bismaleimide, an alkenylphenol and N-vinylpyrrolidone.

Heat-curable bismaleidmide/alkenyl phenol/N-vinyl pyrrolidone resin

Heat-curable bismaleimide resins containing an aromatic alkenyl compound, preferably o,o'-diallylbisphenol A, and a Lewis acid as an additive for prolonging the pot life at elevated temperatures are suitable for impregnating reinforcing fibers, rovings so impregnated having a prolonged gel time and being usable for fabrication of wound structures.

Heat-curable bismaleimide resins

Heat-curable bismaleimide resins contain a bismaleimide and a heterocyclic comonomer having terminal alkenyl or alkenyloxy groups. A preferred comonomer is 2,6-bis-(2-propenylphenoxy)-pyridine. The bismaleimide resins are suitable for the production of high performance composites.

Heat-curable bismaleimide-alkenyl heterocyclic molding material

Novel phenol compounds of the general formula ##STR1## where X is a sulfone group or contains a sulfone group, are suitable for the preparation of epoxy resins, vinyl ester resins, bismaleimide resins and cyanate resins.

Novel polyphenol and thermosetting plastics prepared therefrom

Bismaleimide resins contain a bismaleimide of the formula ##STR1## where R and R' are each hydrogen, methyl or phenyl.

Bismaleimide resin from bis(maleimido phenoxy)benzene

Bismaleimide resion systems containing a bismaleimide and a multinuclear alkenyl and/or alkynyl arene as comonomers have improved toughness while maintaining high glass transition temperatures.

Heat-curable molding compositions

Bismaleimide resin systems containing one or more bismaleimides and an alkenyl and/or alkynyl substituted phenylated dicyclopentadiene comonomer have high glass transition temperatures and impact resistance.

Bismaleimides having the general formula ##STR1## in which n is a whole number between 5 and 70 and --X-- is --O-- or --NH-- are prepared through the reaction of the corresponding amino-terminated polyoxybutylenes with 2 moles of maleic anhydride. They are suited as toughening agents in high grade reactive resins.

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Philipp Eisenbarth