Avery Dennison Corporation

Luminit LLC

Philip Yi Zhi Chu

Eng-Pi Chang

Ronald F Sieloff

Reza Mehrabi

Stanley Tafeng Kao

Hsiao Ken Chuang

Michael Lang

David Nicholas Edwards

Ali Reza Mehrabi

Dong-Tsai Hseih

Le-Hoa Hong

Zhisong Huang

Engin B Arik

Mark Wisniewski

Karen L Spilizewski

Kejian (Kevin) Huang

Edward M Kaiser

Leo Katsenelenson

Thomas C Forrester

Craig S Corcoran

Cindy Chia-Wen Chiu

Lev Katsenelenson

William J Jaecklein

Rishikash K Bharadwai

Robert J Fermin

Chunhwa Wang

Encapsulated LEDs can be made by taking a mold tool defining a cavity that defines a lens shape and providing a patterned release film defining the inverse of a microstructure in a surface of the film. The patterned release film is conformed to the cavity of the mold tool. An LED chip is placed in a spaced relationship from the patterned release film in the cavity. A resin is then introduced into the space between the LED chip and the patterned release film in the cavity. The resin is cured in the space between the LED chip and the patterned release film in the cavity while contact is maintained between the patterned release film and the curing resin. The encapsulated LED is then freed from the mold tool and the patterned release film.

Method to provide microstructure for encapsulated high-brightness LED chips

A method of making a microneedle array structure () comprising a plurality of simultaneously formed microneedles (), each microneedle () having a protrusion () and a passageway () extending therethrough. The method comprises the steps of pressing an embossable sheet material between a complimentary tools and radiantly heating the sheet material using radiant energy from a radiant energy source. One tool is relatively-radiantly-transparent, and another tool and/or the sheet material is relatively-radiantly-absorptive.

Method of making microneedles

The present disclosure reveals a reflective, front-projection screen designed to faithfully and accurately display the images from state-of-the-art (SOTA) and next-generation 2D and 3D motion-picture projectors, such as those found in large-capacity public movie theaters, home theaters, offices, and for use with portable projection systems for consumer and commercial applications. In particular it discloses cinema-size light shaping 3D projection screens with front-surface microstructures and horizontal viewing angles in the range of 90 to 120 degrees.

Projection screen for displaying two-dimensional and three-dimensional motion pictures and method of use thereof

A microchamber structure () comprising a base layer (), a lid layer (), and at least one microchamber () having a cross-sectional shape with a depth (d) of less than 1000 microns and a width (w) of less than 1000 microns. The base layer () includes a depression () and the lid layer () includes a projection () positioned within the depression () to together define the cross-sectional shape of the microchamber ().

Covered microchamber structures

A method of embossing a sheet material includes: heating at least a portion of the sheet directly or indirectly with radiant energy from a radiant energy source; pressing a tool against the heated portion of the sheet, thereby patterning a surface of the sheet; and separating the sheet and the tool. The radiant energy may travel through a solid material that is relatively transparent to radiation, on its way to being absorbed by a relatively-absorptive material. The relatively-transparent material may be an unheated portion of the sheet, and the relatively-absorptive material may be either the tool or the heated portion of the sheet. Alternatively, the relatively-transparent material may be the tool, and the relatively-absorptive material may be all or part of the sheet. The method may be performed as one or more roll-to-roll operations.

Process and apparatus for microreplication

Growing community of inventors

Monrovia, CA, United States of America

Philip Yi Zhi Chu