Laird Technologies Gmbh

Philip Van Haaster

Jeff McFadden

Michael R Lambert

Gerald Robert English

Richard Norman Johnson

Joseph C Boetto

Edward Nakauchi

According to various aspects, exemplary embodiments are disclosed of EMI shields with increased under-shield space and/or greater component clearance for one or more components under the shield. In an exemplary embodiment, a shield generally includes one or more recessed portions along an inner surface of the cover. Dielectric material is along the inner surface of the cover within at least the one or more recessed portions. The one or more recessed portions may provide increased under-shield space and/or greater clearance for one or more components under the shield. The dielectric material may inhibit the one or more recessed portions of the shield from directly contacting and electrically shorting one or more components when the one or more components are under the shield. Also disclosed are exemplary embodiments of methods relating to making EMI shields and methods relating to providing shielding for one or more components on a substrate.

Board level electromagnetic interference (EMI) shields with increased under-shield space

Vent panel

Disclosed are methods and apparatus for improving the resiliency and airflow through a honeycomb air vent filter while providing EMI shielding. In one embodiment, the honeycomb can be manufactured from a dielectric (e.g., plastic) substrate to provide improved resistance to deformation as compared to conventional aluminum honeycomb. The dielectric honeycomb substrate is metallized to provide EMI shielding capability. The metallized honeycomb substrate is cut slightly oversize to fit an opening in an electronic enclosure, which results in elastic deformation of resilient perimeter spring fingers that are used to hold the metallized dielectric honeycomb in place and provide electrical conductivity between the metallized dielectric substrate and the enclosure, thereby eliminating the use of a frame. In another embodiment, additional conductive layers can be added to the metallized dielectric honeycomb. In yet another embodiment, the metallized dielectric honeycomb substrate can be utilized in a framed configuration to provide improved durability.

Methods and apparatus for EMI shielding

According to various aspects, exemplary embodiments are provided of contacts that may be compatible with surface mount technology. The contacts may be surface mountable for establishing an electrical pathway (e.g., electrical grounding contact, etc.) from at least one electrically-conductive surface on the substrate to another electrically-conductive surface (e.g., EMI shield, battery contact, etc.). In one exemplary embodiment, a contact generally includes a resilient dielectric core member. At least one outer electrically-conductive layer is electrocoated onto the resilient dielectric core member. A solderable electrically-conductive base member may be coupled to the resilient core member and/or the outer electrically-conductive layer. The base member may be in electrical contact with the outer electrically-conductive layer.

Electrocoated contacts compatible with surface mount technology

According to various aspects, exemplary embodiments are provided of fabric-over-foam EMI gaskets. In one exemplary embodiment, a fabric-over-foam EMI gasket generally includes a resiliently compressible foam core and an outer electrically-conductive fabric layer. At least one slit extends generally transversely across an upper surface portion of a longitudinally extending region of the gasket.

Fabric-over-foam EMI gaskets having transverse slits and related methods

Lossy materials can be used to suppress EMI transmission. Disclosed are methods for applying lossy materials to EMI shielded enclosures to improve EMI shielding effectiveness and the EMI shielded enclosures so produced. In some embodiments, the EMI shielded enclosure includes a printed-circuit board mountable device. In one embodiment, lossy material can be applied to the interior of an EMI shielded enclosure using an adhesive. In another embodiment, lossy materials can be applied to the exterior of the EMI enclosure to suppress EMI incident upon the EMI shielded enclosure, thereby reducing the susceptibility of electronics contained within the EMI shielded enclosure. In yet another embodiment, lossy materials can be applied to both the interior and exterior of the EMI enclosure.

Growing community of inventors

Corona, CA, United States of America

Philip Van Haaster