Amkor Technology, Inc.

Philip S Mauri

Sean Timothy Crowley

Blake A Gillett

Ferdinand E Belmonte

Remigio V Burro, Jr

Victor M Aquino, Jr

Bradley D Boland

A semiconductor device is disclosed that includes a semiconductor die, a metal leadframe, and a metal strap. A bottom surface of the semiconductor device is on and electrically coupled to a first portion of the leadframe. A first end portion of the metal strap is on and electrically coupled to a top surface of the semiconductor die. An opposite, second end portion of the metal strap is on and electrically coupled to a second portion of the leadframe within a recess of the second portion of the leadframe.

Semiconductor device including metal strap electrically coupled between semiconductor die and metal leadframe

Attaching semiconductor dies to substrates with conductive straps

A method of making an integrated circuit package is disclosed. A conductive first adhesive is applied onto a leadframe pad of a leadframe. A conductive second adhesive is applied on an input portion of the leadframe, such as a leadframe member that is integral with inner portions of input leadfingers. An integrated circuit die, such as a power MOSFET, is placed on the first adhesive on the leadframe pad. A conductive third adhesive is applied onto a surface of the integrated circuit die opposite the leadframe pad. A conductive strap is placed on the third adhesive on the integrated circuit die and on the second adhesive on the leadframe. The first, second and third adhesives are then simultaneously cured so that the integrated circuit die is permanently attached to the leadframe pad, and the conductive strap is permanently attached to the die and the leadframe member.

Conductive strap attachment process that allows electrical connector between an integrated circuit die and leadframe

Growing community of inventors

Cabuyao, Philippines

Philip S Mauri