Ichor Systems, Inc.

Philip Ryan Barros

Chris Melcer

Greg Patrick Mulligan

Randolph E Treur

Todd Mark Cushman

Haruyuki Kubota

Systems for processing articles are essential for semiconductor fabrication. In one embodiment, a system is disclosed comprising a plurality of fluid supplies configured to supply process fluids, a plurality of apparatuses for controlling flow, a plurality of mounting substrates, a vacuum manifold fluidly coupled to the plurality of mounting substrates, an outlet manifold fluidly coupled to the plurality of mounting substrates, a vacuum source fluidly coupled to the vacuum manifold, and a processing chamber fluidly coupled to the outlet manifold. The plurality of apparatuses for controlling flow have a bleed port and an outlet. The outlets of the plurality of apparatuses are fluidly coupled to corresponding outlet ports of the plurality of mounting substrates. The bleed ports of the plurality of apparatuses are fluidly coupled to the corresponding vacuum ports of the plurality of mounting substrates.

Fluid flow control system comprising a manifold assembly

An improved fluid delivery system and method that directly controls the concentration of constituent components in a fluid mixture delivered, for example, to a process chamber. Pressure of the fluid mixture can also be directly controlled. A concentration sensor capable of measuring concentration of all of the constituent components in a fluid mixture is used to provide signals used to vary the flow rate of constituent gases under a closed loop feedback system. The signal output of one or more pressure sensors can also be used to provide a signal used to vary the flow rate of constituent gases under a closed loop feedback system. By directly controlling these two extremely important process variables, embodiments of the present invention provide a significant advantage in measurement accuracy over the prior art, enable real-time process control, reduce system level response time, and allow for a system with a significant footprint reduction.

Fluid control system

A fluid delivery system may include a substrate block having an upper surface; a first substrate port in the upper surface; a second substrate port in the upper surface; a substrate fluid passageway extending between the first substrate port and the second substrate port; a substrate ring defining the second substrate port; and a substrate seal channel formed in the upper surface and surrounding the substrate ring. An outer surface of the substrate ring may form an inner surface of the substrate seal channel. An active component may be selected from a flow controller, a pressure transducer, a flow measurement sensor, a pressure regulator, a valve, and a flow meter. The active component may comprise a lower surface; a first component port in the lower surface; a component fluid passageway; a component ring; and a component seal channel formed in the lower surface and surrounding the component ring.

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Pleasanton, CA, United States of America

Philip Ryan Barros