Memc Electronic Materials, Inc.

Philip R Schmidt

Craig Spohr

Leslie G Stanton

Yoshio Iwamoto

James C Lenk

Jon Seilkop

Kenneth A Ruth

A method for calibrating a semiconductor wafer drying apparatus including a heater and a vessel containing a solvent and capable of receiving semiconductor wafers comprises selecting a test heater temperature and a test processing time. A first set of wafers is placed in the vessel and the heater is operated at the test heater temperature so that a solvent vapor cloud is created in the vessel. The first set of wafers is monitored for substantial envelopment by the vapor cloud during the test processing time. Based on the monitoring step, at least one of the test heater temperature and the test processing time is adjusted to establish at least one operating parameter of an operating heater temperature parameter and an operating processing time parameter for processing successive sets of wafers so as to promote substantial vapor cloud envelopment of each set of wafers dried in the drying apparatus.

Method of calibrating a semiconductor wafer drying apparatus

A device for cleaning semiconductor wafers is provided. The device includes a carrier for holding wafers during the cleaning process. The carrier includes a frame with an open top and a plurality of carrier rods extending between opposite ends of the frame. The carrier rods have grooves that receive marginal edge portions of the wafers to retain them against movement in the carrier during cleaning and transportation. The grooves are structured to reduce the amount of contaminants remaining on the wafers after cleaning. The frame may be made substantially entirely of a polymeric material.

Apparatus for cleaning semiconductor wafers

A collector and method for collecting samples of liquid from at least one source of liquid for automated analysis of the samples. The collector has at least one receptacle for receiving liquid from the source of liquid and holding a quantity of the liquid for obtaining a sample. Each receptacle has an inlet for delivery of liquid from the respective source of liquid and an open top sized to admit the sample collection device into the receptacle. The collector also has a spillway in fluid communication with the open top of the receptacle for receiving excess liquid spilling over the open top of the receptacle. The collector is constructed so that liquid continuously flows through the collector. A drain of the collector receives liquid from the spillway for draining the liquid from the collector.

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St. Charles, MO, United States of America

Philip R Schmidt