International Business Machines Corporation

Intermec IP Corporation

Philip Murphy

Paul Andrew Moskowitz

Michael John Brady

Dah-Weih Duan

Daniel Joseph Friedman

Thomas Mario Cipolla

Venkata S R Kodukula

Francois Guindon

Paul William Coteus

Harley K Heinrich

George Frederick Walker

Donald Francis Canaperi

Eric Jeffrey White

Mahadevaiyer Krishnan

Michael F Lofaro

Raymond R Horton

Rene D Martinez

Michael J Palmer

William J Cote

Mark B Ritter

Thomas Anthony Cofino

Dale L Scott

Glen Walden Johnson

Joyce C Liu

Paul M Feeney

Pedro A Chalco

Luc Beauvillier

Michael Louis Pinch

Michael Brent Madrid

Christopher W Oden

Paul W Cotues

Normand Gilles Favreau

The present invention provides an RF tag having an antenna that can be selectively tuned to achieve optimal performance. The RF tag comprises an RF transponder integrated circuit and an antenna connected to the RF transponder integrated circuit. The antenna includes components such as tuning stubs and loading bars that are physically alterable to selectively vary the performance characteristics of the antenna. The tuning stub and loading bar may each further comprising a variably selectable length having elements that may be removed by punching, cutting, etching, laser trimming or other process. The antenna may further comprise a leadframe or a flexible substrate.

Adjustable length antenna system for RF transponders

Slurry compositions comprising an oxidizing agent, copper corrosion inhibitor, abrasive particles; surface active agent and polyelectrolyte are useful for polishing or planarizing chip interconnect/wiring material such as Al, W and especially Cu.

Slurry for mechanical polishing (CMP) of metals and use thereof

A radio frequency identification transponder has a high gain antenna for increased range. In an embodiment, the radio frequency transponder has a reflector to increase its operative range. A system of one or more reflectors is operatively associated with a transponder and may be formed out of any sort of radio frequency reflective material. The reflector system can enhance reception or transmission of radio waves by or from the transponder. The reflector system may also be used to provide for selective coupling of the radio frequency transponder with a base station, user- or vehicle-supported reader, or the like based on relative orientation. In addition, the reflector system may be used to selectively reflect particular radio waves. In another embodiment, the radio frequency transponder has a horn antenna providing increased gain and directivity. In yet another embodiment, the radio frequency transponder has a patch antenna providing increased gain and circular polarization. The patch antenna may further comprise a patch antenna array, a multi-layer patch or a dipole comprised of patch elements.

Radio frequency identification transponder having a high gain antenna configuration

The present invention provides a method and apparatus for testing RFID tags using wireless radio frequency (RF) communication. The method and apparatus allow RFID tags to be tested individually or in groups while they are in close proximity to each other (e.g., within the read range of the tag).

Method and apparatus for testing RFID tags

Manufacturing of a novel thin and flexible radio frequency (RF) tag with a stamped metal leadframe antenna is disclosed. The tag is made by transporting a leadframe strip having leadframe antenna 'cutouts' to a point where a chip is mechanically and electrically attached directly to the leadframe antenna. A battery can be attached to the chip in the process. Processes to cut support bars holding the leadframe antenna to the leadframe strip, seal the package (by lamination or molding), and to excise the sealed component are performed in various orders to produce a final product. Intermediate support (positioners) for the thin leadframe are optionally provided add structural support to the antenna while the sealed component is made. A protective surround can be added to cover the package and to provide further structural support for the package while still permitting the sealed component to be thin and flexible.

Method of making a thin radio frequency transponder

A novel radio frequency transponder (tag) with a minimum of components and connects is thin and flexible because these components and connects can be unsupported by a substrate layer. This is accomplished by using a conducting leadframe structure not only as a connection medium but also as a circuit element, i.e., the transponder antenna. In various preferred embodiments, the leadframe is mechanically positioned and fixably attached to a circuit chip so that the leadframe (antenna) is self supporting. A protective coating can be added where the leadframe is attached to the circuit chip. Further a protective surrounding can envelops the entire leadframe antenna, circuit chip, and, if provided, the protective coating.

Thin radio frequency transponder with leadframe antenna structure

An electronic device packaging structure is described wherein an electronic device is electrically connected to a substrate wherein the electronic device subtends a non-normal angle with respect to the substrate. In a more specific embodiment, a plurality of electronic devices are stacked at offset with respect to each other to expose contact locations on the surface of each electronic device at an edge of each electronic device to form a stepped surface exposing a plurality of electronic device contact locations. This surface is disposed against a substrate having a plurality of contact locations thereon. The electronic device contact locations can be electrically interconnected to the substrate contact locations by solder mounds or alternatively by a cylindrical shaped elastomeric body having metallization bands with a spacing corresponding to the electronic device contact locations. The elastomeric body is pressed between the edge of the stacked electronic devices having the contact locations thereon and substrate surface to form electrical interconnections between electronic device contact locations and substrate contact locations through the electrically conducting bands. The stacked electronic devices can be thermally connected to a heat dissipation member. The stacked electronic devices can have a stepped surface embodying an enhanced area for transfer of heat from the electronic device stack to the heat dissipation member.

Stepped electronic device package

A method is described for aligning a contact pattern on an electronic device held by a first movable support, with a bond site pattern on a lead frame held by a second movable support. The method includes the steps of: (a) creating and storing models of a chip's contact pattern and a lead frame's bond site pattern; (b) imaging the electronic device and lead frame; (c) determining the position of contacts on said electronic device and reorienting the contact pattern model to a best fit with the imaged contact position; (d) determining the position of each bond site on the imaged lead frame and reorienting the bond site model to a best fit with the imaged bond site position; (e) determining positional differences between the reoriented lead frame and contact pattern models; and (f) generating signals to reorient the first and second movable supports to minimize the positional differences when they are moved into a bonding positon. A machine is described for performing the above method wherein each of three main movable elements of the machine is assigned a dimensional axis in which its travel is non-adjustable, so that other movable elements can be calibrated thereagainst.

Apparatus and method for inspection and alignment of semiconductor chips

Apparatus for automatically adjusting the orientation of a first surface of a first body to be against a second surface of a second body when said first surface is pressed against said second surface. The apparatus includes a means for movably mounting the first body to a support which permits rotation of the first surface so that when the first surface is pressed against the second surface, the first surface rotates with respect to the support resulting in the first surface being against the second surface.

Alignment device

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New Fairfield, CT, United States of America

Philip Murphy