International Business Machines Corporation

Lenovo (singapore) Pte. Ltd.

Philip Michael Corcoran

Edward Joseph Seminaro

Robert G Atkins

Eric Alan Eckberg

Edward N Cohen

Joseph Daniel Rico

Dennis R Barringer

Patrick Allen Buckland

William P Kostenko

William J Petrowsky

Jeffrey Alan Verkerke

A hardware retention mechanism comprising a frame including a first guide shoulder and a pivot point; an actuator arm including a first guide post; and a first shape memory alloy wire strung between the first guide shoulder and the first guide post that rotates the actuator arm between a locked position and an unlocked position. The actuator arm is rotatable around the pivot point between a locked position and an unlocked position. In some embodiments, the frame may further comprise a second guide shoulder, the actuator arm may further comprise a second guide post, and a second shape memory alloy wire may be strung between the second guide shoulder and the second guide post that rotates the actuator arm between an unlocked position and a locked position.

Shape memory alloy locking mechanism

A method, apparatus, and computer program product for load shedding during an emergency power off event. In one embodiment, power is supplied from a main power source to a plurality of electrical loads within a device enclosure. Power loss is detected from the main power source. Upon detecting the power loss, at least one of the electrical loads is disconnected from a supplemental power source such that power to at least one remaining load connected to the supplemental power source is sustained by the supplementary power source.

Load shedding during emergency power off event

An input/output (I/O) and disk expansion subsystem is provided for an electronics rack which provides expanded I/O and/or disk storage capabilities to electronic subsystems of the rack. The expansion subsystem includes a subsystem enclosure having first and second sides in opposing relation, with the first side accessible through a front of the rack and the second accessible through a back of the rack when the enclosure resides within the rack. A plurality of field-replaceable units reside within the subsystem enclosure, and are accessible and removable through the first or second sides of the enclosure without removing the enclosure from the rack. The field-replaceable units include an input/output adapter cage(s), a storage device cage, power and control supplies, fan assemblies, and a midplane connector assembly. The adapter cage, storage device cage, and power and control supply dock to and are electrically interconnected by the midplane connector assembly.

Input/output and disk expansion subsystem for an electronics rack

An energy management control method and controller reduce power supply current and/or subsystem cooling overhead that reduces system efficiency, may reduce system reliability and may increase ambient noise. Multiple device connectors are supplied from corresponding soft switches that are programmed to provide a current level that is sufficient to supply the maximum current for the device installed in the corresponding device connector. The current level may be determined from device information provided from the device during initialization, which may directly specify a maximum current requirement. Alternatively, the maximum current requirement can be determined from other device-identifying information such as a unique device identifier. As a result a guaranteed maximum current or power and power dissipation can be determined, and multiple power supplies and/or cooling devices such as air movement devices (AMDs) may be enabled, disabled or otherwise controlled accordingly.

Power bus current bounding using local current-limiting soft-switches and device requirements information

An I/O subsystem for providing a high density modular input/output package in a data processing system. The I/O subsystem includes an enclosure having a midplane assembly in the center portion. The enclosure includes electrical components including redundant power supplies, air moving units and DASD carriers having DASD drives assemblies therein in the front portion of the enclosure, and planar boards having PCI card assemblies slidably mounted thereon in the rear portion of the enclosure. The mid plane includes multiconductor power buses for distribution of power from the power supplies to the electrical components of the I/O subsystem.

High density modular input/output package in a data processing system

The present invention includes a driving circuit and method for driving signals. An input signal is received by the driving circuit on an input signal line which is connected to a bias circuit for a common voltage level. Two output lines from the driving circuit are driven to the receiver which is capable of using differential output lines or a selected single ended output line. Furthermore, the output lines may be driven to a high impedance selected by the voltage level of the input signal. The receiver of the output lines may be a SCSI device using multimode terminators which include low voltage differential and a single ended mode.

Growing community of inventors

Highland, NY, United States of America

Philip Michael Corcoran