Sophia Wireless, Inc.

Philip Joseph Koh

David Thompson Nemeth

A resonator filter assembly is provided having a first wafer (), a second wafer () and a third wafer (). A plurality of pits are etched in the first and second wafer () and arranged such that a plurality of resonant cavities () are formed with a coupling cavity () disposed between the resonant cavities (). By altering the dimensions of the resonant and coupling cavities (), the frequency characteristics of the filter can be adjusted as desired.

Coupled resonator filters formed by micromachining

A direct attachment technique is described for silicon packages housing high frequency devices. A silicon package may be shaped as either a plug or a socket or the package may have both the plug and socket capability, thus enabling the package to be directly attached to other packages The plug is trapezoidal in cross section while the socket has a dovetail-joint-like aperture. The plug is inserted into the socket thereby directly attaching one package to another. The two packages are locked together when the slanted edges of the plug are fitted to the slanted edges of the socket.

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Centerville, VA, United States of America

Philip Joseph Koh