Chip Coolers, Inc.

Philip Johnson

A heat dissipating device which can provide multiple levels of pressure to a semiconductor package, having an outer peripheral ceramic region and an inner silicon region and installed in a socket, is provided. A clip member is provided with a central female-threaded bore. A collar, having outer male threads and inner female threads is threadably receivable within the bore of the clip member. The collar is threaded down into the bore to communicate with an upper surface of the ceramic portion of a semiconductor device at a first pressure which is high enough to maintain the package in electrical communication with its socket. A heat dissipating member, having a male-threaded base, is threadably installed into the female-threaded bore of the collar to engage the upper surface of the silicon portion of the semiconductor package. The pressure of the heat dissipating member onto the silicon portion of the package is independently adjustable relative to the pressure of the collar onto the ceramic portion of the semiconductor package. As a result, the multiple pressure requirements of the semiconductor package can be accommodated in a single heat dissipating device.

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Kingston, NH, United States of America

Philip Johnson